JPS5612743A - Processing method of projection for conductive layer of substrate - Google Patents

Processing method of projection for conductive layer of substrate

Info

Publication number
JPS5612743A
JPS5612743A JP8784179A JP8784179A JPS5612743A JP S5612743 A JPS5612743 A JP S5612743A JP 8784179 A JP8784179 A JP 8784179A JP 8784179 A JP8784179 A JP 8784179A JP S5612743 A JPS5612743 A JP S5612743A
Authority
JP
Japan
Prior art keywords
metal foil
resist
projection
substrate
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8784179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628946B2 (https=
Inventor
Kazuyoshi Hanihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP8784179A priority Critical patent/JPS5612743A/ja
Publication of JPS5612743A publication Critical patent/JPS5612743A/ja
Publication of JPS628946B2 publication Critical patent/JPS628946B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
JP8784179A 1979-07-11 1979-07-11 Processing method of projection for conductive layer of substrate Granted JPS5612743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8784179A JPS5612743A (en) 1979-07-11 1979-07-11 Processing method of projection for conductive layer of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8784179A JPS5612743A (en) 1979-07-11 1979-07-11 Processing method of projection for conductive layer of substrate

Publications (2)

Publication Number Publication Date
JPS5612743A true JPS5612743A (en) 1981-02-07
JPS628946B2 JPS628946B2 (https=) 1987-02-25

Family

ID=13926127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8784179A Granted JPS5612743A (en) 1979-07-11 1979-07-11 Processing method of projection for conductive layer of substrate

Country Status (1)

Country Link
JP (1) JPS5612743A (https=)

Also Published As

Publication number Publication date
JPS628946B2 (https=) 1987-02-25

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