JPS559410A - Method of and device for printing etching resist ink to copper through hole substrate - Google Patents

Method of and device for printing etching resist ink to copper through hole substrate

Info

Publication number
JPS559410A
JPS559410A JP8145778A JP8145778A JPS559410A JP S559410 A JPS559410 A JP S559410A JP 8145778 A JP8145778 A JP 8145778A JP 8145778 A JP8145778 A JP 8145778A JP S559410 A JPS559410 A JP S559410A
Authority
JP
Japan
Prior art keywords
copper
etching resist
resist ink
hole substrate
printing etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8145778A
Other languages
Japanese (ja)
Other versions
JPS635917B2 (en
Inventor
Hiroshige Sawa
Takaaki Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8145778A priority Critical patent/JPS559410A/en
Publication of JPS559410A publication Critical patent/JPS559410A/en
Publication of JPS635917B2 publication Critical patent/JPS635917B2/ja
Granted legal-status Critical Current

Links

JP8145778A 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate Granted JPS559410A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8145778A JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8145778A JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Publications (2)

Publication Number Publication Date
JPS559410A true JPS559410A (en) 1980-01-23
JPS635917B2 JPS635917B2 (en) 1988-02-05

Family

ID=13746923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8145778A Granted JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Country Status (1)

Country Link
JP (1) JPS559410A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137978A (en) * 1983-12-27 1985-07-22 Dainippon Ink & Chem Inc Aqueous contact adhesive
JPS62112615A (en) * 1985-11-07 1987-05-23 ヒユ−ルス・アクチエンゲゼルシヤフト Production of thermoplastic material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509344A (en) * 1973-05-22 1975-01-30
JPS52120954U (en) * 1976-02-18 1977-09-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509344A (en) * 1973-05-22 1975-01-30
JPS52120954U (en) * 1976-02-18 1977-09-14

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137978A (en) * 1983-12-27 1985-07-22 Dainippon Ink & Chem Inc Aqueous contact adhesive
JPS6344793B2 (en) * 1983-12-27 1988-09-06 Dainippon Ink & Chemicals
JPS62112615A (en) * 1985-11-07 1987-05-23 ヒユ−ルス・アクチエンゲゼルシヤフト Production of thermoplastic material
JPH0470322B2 (en) * 1985-11-07 1992-11-10 Huels Chemische Werke Ag

Also Published As

Publication number Publication date
JPS635917B2 (en) 1988-02-05

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