JPS56100451A - Manufacture of electrode of semiconductor device - Google Patents
Manufacture of electrode of semiconductor deviceInfo
- Publication number
- JPS56100451A JPS56100451A JP277680A JP277680A JPS56100451A JP S56100451 A JPS56100451 A JP S56100451A JP 277680 A JP277680 A JP 277680A JP 277680 A JP277680 A JP 277680A JP S56100451 A JPS56100451 A JP S56100451A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- film
- metal
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000010410 layer Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by physical means, e.g. sputtering, evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To reduce a value of contact resistance and obtain a uniform electrode by forming the electrode by application of a laser beam to a window for electrode in a semiconductor substrate in vacuum and then by evaporation of metal thereon. CONSTITUTION:An n layer is provided on the P type substrate, while the window for electrode is provided in an SiO2 film 3. The laser beam is applied in vacuum and the surface of the n layer 2 thus exposed in heated at high temperature. By this heating, impurities, organic substances and the thin SiO2 film on the surface are vaporized and thereby the surface is purified. Al7 is evaporated immediately, whereon an alloy film 8 such as Si and further Cu is laid. Finally, the metal films 7 and 8 are etched selectively, thereby an electrode pattern is provided, the device thus prepared is processed in N at about 400 deg.C, Si and metal are alloyed on the interface between the film 7 and the n layer 2, and thus ohmic connection is completed. By this method, cooling is performed in a short time since the uppermost surface layer of the substrate alone is heated, and thus the electrode which has low value of contact resistance and uniformity can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP277680A JPS56100451A (en) | 1980-01-14 | 1980-01-14 | Manufacture of electrode of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP277680A JPS56100451A (en) | 1980-01-14 | 1980-01-14 | Manufacture of electrode of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56100451A true JPS56100451A (en) | 1981-08-12 |
Family
ID=11538737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP277680A Pending JPS56100451A (en) | 1980-01-14 | 1980-01-14 | Manufacture of electrode of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56100451A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6477144A (en) * | 1987-09-18 | 1989-03-23 | Nec Corp | Growth method of metallic film for semiconductor device |
US4957880A (en) * | 1985-05-29 | 1990-09-18 | Kabushiki Kaisha Toshiba | Method for producing semiconductor device including a refractory metal pattern |
US5279973A (en) * | 1990-10-16 | 1994-01-18 | Kabushiki Kaisha Toshiba | Rapid thermal annealing for semiconductor substrate by using incoherent light |
US6645359B1 (en) | 2000-10-06 | 2003-11-11 | Roche Diagnostics Corporation | Biosensor |
US6662439B1 (en) | 1999-10-04 | 2003-12-16 | Roche Diagnostics Corporation | Laser defined features for patterned laminates and electrodes |
US6866758B2 (en) | 2002-03-21 | 2005-03-15 | Roche Diagnostics Corporation | Biosensor |
US6911621B2 (en) | 2000-11-01 | 2005-06-28 | Roche Diagnostics Corporation | Biosensor |
US7073246B2 (en) | 1999-10-04 | 2006-07-11 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US7476827B1 (en) | 2001-08-29 | 2009-01-13 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
CN108155144A (en) * | 2016-12-02 | 2018-06-12 | 中芯国际集成电路制造(上海)有限公司 | A kind of production method of semiconductor devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124883A (en) * | 1976-04-12 | 1977-10-20 | Mitsubishi Electric Corp | Local connection method of semiconductor crystal substrate and metal wiring |
-
1980
- 1980-01-14 JP JP277680A patent/JPS56100451A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124883A (en) * | 1976-04-12 | 1977-10-20 | Mitsubishi Electric Corp | Local connection method of semiconductor crystal substrate and metal wiring |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4957880A (en) * | 1985-05-29 | 1990-09-18 | Kabushiki Kaisha Toshiba | Method for producing semiconductor device including a refractory metal pattern |
JPS6477144A (en) * | 1987-09-18 | 1989-03-23 | Nec Corp | Growth method of metallic film for semiconductor device |
US5279973A (en) * | 1990-10-16 | 1994-01-18 | Kabushiki Kaisha Toshiba | Rapid thermal annealing for semiconductor substrate by using incoherent light |
US6662439B1 (en) | 1999-10-04 | 2003-12-16 | Roche Diagnostics Corporation | Laser defined features for patterned laminates and electrodes |
US7073246B2 (en) | 1999-10-04 | 2006-07-11 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US7386937B2 (en) | 1999-10-04 | 2008-06-17 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US6645359B1 (en) | 2000-10-06 | 2003-11-11 | Roche Diagnostics Corporation | Biosensor |
US6911621B2 (en) | 2000-11-01 | 2005-06-28 | Roche Diagnostics Corporation | Biosensor |
US7476827B1 (en) | 2001-08-29 | 2009-01-13 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US6866758B2 (en) | 2002-03-21 | 2005-03-15 | Roche Diagnostics Corporation | Biosensor |
CN108155144A (en) * | 2016-12-02 | 2018-06-12 | 中芯国际集成电路制造(上海)有限公司 | A kind of production method of semiconductor devices |
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