JPS5588336A - Pattern formation by anisotropic etching reagent - Google Patents

Pattern formation by anisotropic etching reagent

Info

Publication number
JPS5588336A
JPS5588336A JP15997378A JP15997378A JPS5588336A JP S5588336 A JPS5588336 A JP S5588336A JP 15997378 A JP15997378 A JP 15997378A JP 15997378 A JP15997378 A JP 15997378A JP S5588336 A JPS5588336 A JP S5588336A
Authority
JP
Japan
Prior art keywords
silicon substrate
mask
etching reagent
anisotropic etching
rectangular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15997378A
Other languages
Japanese (ja)
Inventor
Kiyoshi Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15997378A priority Critical patent/JPS5588336A/en
Publication of JPS5588336A publication Critical patent/JPS5588336A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To obtain a perfect rectangular etching pattern by a method wherein the rectangular mask is arranged with its one side taken at a specific angle in <110> direction of a silicon substrate, and an anisotropic etching reagent is used therefor.
CONSTITUTION: An SiO2 film is formed on a silicon substrate with (100) face as the surface, and the SiO2 film is processed to a rectangular pattern mask through photolithography. When forming the rectangular pattern mask, an arrangement is such that one side of the mask will form a specific angle (θ) or will incline 53°, 37°, or 4° in <110> direction of the silicon substrate. Then, the silicon substrate is subjected to etching by means of an anisotrophic etching reagent or, for example, an aqueous solution of ethylenediamine and pyrocatechol. With the top smaller than the bottom, a perfect rectangular pattern is thus obtainable.
COPYRIGHT: (C)1980,JPO&Japio
JP15997378A 1978-12-27 1978-12-27 Pattern formation by anisotropic etching reagent Pending JPS5588336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15997378A JPS5588336A (en) 1978-12-27 1978-12-27 Pattern formation by anisotropic etching reagent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15997378A JPS5588336A (en) 1978-12-27 1978-12-27 Pattern formation by anisotropic etching reagent

Publications (1)

Publication Number Publication Date
JPS5588336A true JPS5588336A (en) 1980-07-04

Family

ID=15705210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15997378A Pending JPS5588336A (en) 1978-12-27 1978-12-27 Pattern formation by anisotropic etching reagent

Country Status (1)

Country Link
JP (1) JPS5588336A (en)

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