JPS5568642A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5568642A JPS5568642A JP14237978A JP14237978A JPS5568642A JP S5568642 A JPS5568642 A JP S5568642A JP 14237978 A JP14237978 A JP 14237978A JP 14237978 A JP14237978 A JP 14237978A JP S5568642 A JPS5568642 A JP S5568642A
- Authority
- JP
- Japan
- Prior art keywords
- connection wire
- lead
- lead piece
- coming
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14237978A JPS5568642A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14237978A JPS5568642A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5568642A true JPS5568642A (en) | 1980-05-23 |
Family
ID=15313996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14237978A Pending JPS5568642A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5568642A (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51103772A (ja) * | 1975-03-10 | 1976-09-13 | Tokyo Shibaura Electric Co | Handotaisochi |
JPS53126268A (en) * | 1977-04-11 | 1978-11-04 | Hitachi Ltd | Semiconductor device |
-
1978
- 1978-11-20 JP JP14237978A patent/JPS5568642A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51103772A (ja) * | 1975-03-10 | 1976-09-13 | Tokyo Shibaura Electric Co | Handotaisochi |
JPS53126268A (en) * | 1977-04-11 | 1978-11-04 | Hitachi Ltd | Semiconductor device |
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