JPS5555541A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS5555541A
JPS5555541A JP12834878A JP12834878A JPS5555541A JP S5555541 A JPS5555541 A JP S5555541A JP 12834878 A JP12834878 A JP 12834878A JP 12834878 A JP12834878 A JP 12834878A JP S5555541 A JPS5555541 A JP S5555541A
Authority
JP
Japan
Prior art keywords
wire
pad
bonding
fixed
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12834878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211499B2 (enrdf_load_stackoverflow
Inventor
Tamotsu Usami
Kanji Otsuka
Yukiaki Ueno
Akira Masaki
Hiroki Yamashita
Tadao Kachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12834878A priority Critical patent/JPS5555541A/ja
Priority to DE19792942394 priority patent/DE2942394A1/de
Publication of JPS5555541A publication Critical patent/JPS5555541A/ja
Publication of JPS6211499B2 publication Critical patent/JPS6211499B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
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    • H01L2224/85206—Direction of oscillation
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12834878A 1978-10-20 1978-10-20 Semiconductor element Granted JPS5555541A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP12834878A JPS5555541A (en) 1978-10-20 1978-10-20 Semiconductor element
DE19792942394 DE2942394A1 (de) 1978-10-20 1979-10-19 Halbleiteranordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12834878A JPS5555541A (en) 1978-10-20 1978-10-20 Semiconductor element

Publications (2)

Publication Number Publication Date
JPS5555541A true JPS5555541A (en) 1980-04-23
JPS6211499B2 JPS6211499B2 (enrdf_load_stackoverflow) 1987-03-12

Family

ID=14982579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12834878A Granted JPS5555541A (en) 1978-10-20 1978-10-20 Semiconductor element

Country Status (2)

Country Link
JP (1) JPS5555541A (enrdf_load_stackoverflow)
DE (1) DE2942394A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196615A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 半導体素子搭載用基板

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2616964B1 (fr) * 1987-06-19 1990-03-02 Thomson Composants Militaires Puce de circuit integre avec plots d'entree-sortie allonges
US4959706A (en) * 1988-05-23 1990-09-25 United Technologies Corporation Integrated circuit having an improved bond pad
JP2768822B2 (ja) * 1990-11-29 1998-06-25 株式会社東芝 ワイヤボンディグ方式半導体装置
US5340772A (en) * 1992-07-17 1994-08-23 Lsi Logic Corporation Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
US5404047A (en) * 1992-07-17 1995-04-04 Lsi Logic Corporation Semiconductor die having a high density array of composite bond pads
US6262434B1 (en) 1996-08-23 2001-07-17 California Micro Devices Corporation Integrated circuit structures and methods to facilitate accurate measurement of the IC devices
DE102008013756B4 (de) * 2008-03-12 2019-08-22 F&K Delvotec Bondtechnik Gmbh Verfahren und Drahtbonder zur Herstellung einer Golddraht-Bondverbindung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
CH592366A5 (enrdf_load_stackoverflow) * 1975-06-05 1977-10-31 Ebauches Sa

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196615A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 半導体素子搭載用基板

Also Published As

Publication number Publication date
JPS6211499B2 (enrdf_load_stackoverflow) 1987-03-12
DE2942394A1 (de) 1980-05-08
DE2942394C2 (enrdf_load_stackoverflow) 1991-05-02

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