JPS5553448A - Semiconductor element holding tape and mounting of element on wafer - Google Patents

Semiconductor element holding tape and mounting of element on wafer

Info

Publication number
JPS5553448A
JPS5553448A JP12624278A JP12624278A JPS5553448A JP S5553448 A JPS5553448 A JP S5553448A JP 12624278 A JP12624278 A JP 12624278A JP 12624278 A JP12624278 A JP 12624278A JP S5553448 A JPS5553448 A JP S5553448A
Authority
JP
Japan
Prior art keywords
tape
wafer
glueing
transistor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12624278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135696B2 (enrdf_load_stackoverflow
Inventor
Minoru Imai
Noboru Iida
Yoshiaki Kawai
Yasuo Taira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12624278A priority Critical patent/JPS5553448A/ja
Publication of JPS5553448A publication Critical patent/JPS5553448A/ja
Publication of JPS6135696B2 publication Critical patent/JPS6135696B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
JP12624278A 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer Granted JPS5553448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12624278A JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12624278A JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Publications (2)

Publication Number Publication Date
JPS5553448A true JPS5553448A (en) 1980-04-18
JPS6135696B2 JPS6135696B2 (enrdf_load_stackoverflow) 1986-08-14

Family

ID=14930304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12624278A Granted JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Country Status (1)

Country Link
JP (1) JPS5553448A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768053A (en) * 1980-10-16 1982-04-26 Seiko Epson Corp Integrated circuit package
JPS5840858U (ja) * 1981-08-26 1983-03-17 クラリオン株式会社 チツプ部品
JPS58196099A (ja) * 1982-05-11 1983-11-15 松下電器産業株式会社 電子部品装着装置
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
DE10044418A1 (de) * 2000-09-08 2002-04-18 Siemens Ag Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62151865U (enrdf_load_stackoverflow) * 1986-03-18 1987-09-26

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768053A (en) * 1980-10-16 1982-04-26 Seiko Epson Corp Integrated circuit package
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
JPS5840858U (ja) * 1981-08-26 1983-03-17 クラリオン株式会社 チツプ部品
JPS58196099A (ja) * 1982-05-11 1983-11-15 松下電器産業株式会社 電子部品装着装置
DE10044418A1 (de) * 2000-09-08 2002-04-18 Siemens Ag Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt
DE10044418C2 (de) * 2000-09-08 2002-09-19 Siemens Ag Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt

Also Published As

Publication number Publication date
JPS6135696B2 (enrdf_load_stackoverflow) 1986-08-14

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