JPS5548991A - Semiconductor joining laser forming method - Google Patents

Semiconductor joining laser forming method

Info

Publication number
JPS5548991A
JPS5548991A JP11679378A JP11679378A JPS5548991A JP S5548991 A JPS5548991 A JP S5548991A JP 11679378 A JP11679378 A JP 11679378A JP 11679378 A JP11679378 A JP 11679378A JP S5548991 A JPS5548991 A JP S5548991A
Authority
JP
Japan
Prior art keywords
layer
type
growth
width
epi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11679378A
Other languages
Japanese (ja)
Other versions
JPS613117B2 (en
Inventor
Isamu Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11679378A priority Critical patent/JPS5548991A/en
Publication of JPS5548991A publication Critical patent/JPS5548991A/en
Publication of JPS613117B2 publication Critical patent/JPS613117B2/ja
Granted legal-status Critical Current

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  • Semiconductor Lasers (AREA)

Abstract

PURPOSE: To obtain a high-efficiency laser device, by allowing a small-reflectivity layer to grow on an activation layer by the first phase epitaxial growth, allowing growth only inside of a narrow-width groove, which is kept apart by prescribed width and in parallel, by the second phase epitaxial growth and embedding side surfaces.
CONSTITUTION: An n-type Al0.3Ga0.7As 7, a GaAs activation layer 8 and a p-type Al0.3Ga0.7As 9 are epi-formed on an n-type GaAs 6, and by etching the layer 7 through 9, grooves of approximately 20μm in width are provided on both sides of a belt-like layer of approximately 5mm in width. After washing crystllized surface, a p-type Al0.3Ga0.7As 10 and an n-type Al0.3Ga0.7As 11 are epi-formed. By using a constant growth speed and a constant cooling speed, the crystallized surface is flatly formed. Since there is no more epi-formation on AlGaAs having been once aerated, surface of the layer 9 is free from growth layer. Electrodes 13 and 14 are formed, and when the electrode 14 is driven as positive, the layers 11 and 10 are conversely biased and the most part of the current needed for radiation of the activation layer is caught by a layer 15, and therefore, a laser of high conversion efficiency can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
JP11679378A 1978-09-21 1978-09-21 Semiconductor joining laser forming method Granted JPS5548991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11679378A JPS5548991A (en) 1978-09-21 1978-09-21 Semiconductor joining laser forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11679378A JPS5548991A (en) 1978-09-21 1978-09-21 Semiconductor joining laser forming method

Publications (2)

Publication Number Publication Date
JPS5548991A true JPS5548991A (en) 1980-04-08
JPS613117B2 JPS613117B2 (en) 1986-01-30

Family

ID=14695817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11679378A Granted JPS5548991A (en) 1978-09-21 1978-09-21 Semiconductor joining laser forming method

Country Status (1)

Country Link
JP (1) JPS5548991A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57206082A (en) * 1981-06-12 1982-12-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser
JPS5866664U (en) * 1981-10-29 1983-05-06 日本電気株式会社 Buried structure semiconductor laser device
JPS5882589A (en) * 1981-11-12 1983-05-18 Nec Corp Semiconductor laser
JPS5884484A (en) * 1981-11-12 1983-05-20 Nec Corp Semiconductor laser-photodiode beam integrating element
JPS5885584A (en) * 1981-11-16 1983-05-21 Nec Corp Semiconductor laser

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111323955B (en) * 2020-04-07 2022-07-22 京东方科技集团股份有限公司 Display panel, cutting method thereof and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57206082A (en) * 1981-06-12 1982-12-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser
JPS5866664U (en) * 1981-10-29 1983-05-06 日本電気株式会社 Buried structure semiconductor laser device
JPS5882589A (en) * 1981-11-12 1983-05-18 Nec Corp Semiconductor laser
JPS5884484A (en) * 1981-11-12 1983-05-20 Nec Corp Semiconductor laser-photodiode beam integrating element
JPS6358391B2 (en) * 1981-11-12 1988-11-15 Nippon Electric Co
JPS5885584A (en) * 1981-11-16 1983-05-21 Nec Corp Semiconductor laser

Also Published As

Publication number Publication date
JPS613117B2 (en) 1986-01-30

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