JPS5546582A - Method of fabricating semiconductor device - Google Patents

Method of fabricating semiconductor device

Info

Publication number
JPS5546582A
JPS5546582A JP12087878A JP12087878A JPS5546582A JP S5546582 A JPS5546582 A JP S5546582A JP 12087878 A JP12087878 A JP 12087878A JP 12087878 A JP12087878 A JP 12087878A JP S5546582 A JPS5546582 A JP S5546582A
Authority
JP
Japan
Prior art keywords
film
projections
remove
coated
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12087878A
Other languages
Japanese (ja)
Inventor
Keimei Mikoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12087878A priority Critical patent/JPS5546582A/en
Publication of JPS5546582A publication Critical patent/JPS5546582A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To readily flatten the surface of a semiconductor device by coating photoresist on the entire surface when removing the projections occurred on the surface of a semiconductor substrate, removing the resist coated on the projections, and then etching to remove only the projections.
CONSTITUTION: When projections 2 are produced on the insulating film 1 coated on a semiconductor substrate, the following treatment is conducted to remove them and flatten the surfade. That is, photoresist having low viscosity for the film 1 is coated by spinning method to generate thick resist film 3-1 on the lower surface and thin resist film 3-2 on the projection 2 on the film 1. Then, light is exposed and developed on the films to thereby remove only the film 3-2 by utilizing the difference of their thickness. Then, the film 3-1 retained is etched though the film is thinned to eliminate the projections 2. Thus, when metallic wiring is provided on the film 1, no wire breakage occurs.
COPYRIGHT: (C)1980,JPO&Japio
JP12087878A 1978-09-29 1978-09-29 Method of fabricating semiconductor device Pending JPS5546582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12087878A JPS5546582A (en) 1978-09-29 1978-09-29 Method of fabricating semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12087878A JPS5546582A (en) 1978-09-29 1978-09-29 Method of fabricating semiconductor device

Publications (1)

Publication Number Publication Date
JPS5546582A true JPS5546582A (en) 1980-04-01

Family

ID=14797191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12087878A Pending JPS5546582A (en) 1978-09-29 1978-09-29 Method of fabricating semiconductor device

Country Status (1)

Country Link
JP (1) JPS5546582A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851856A (en) * 1993-12-03 1998-12-22 Yamaha Corporation Manufacture of application-specific IC

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5383467A (en) * 1976-11-30 1978-07-22 Nec Corp Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5383467A (en) * 1976-11-30 1978-07-22 Nec Corp Production of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851856A (en) * 1993-12-03 1998-12-22 Yamaha Corporation Manufacture of application-specific IC

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