JPS5546582A - Method of fabricating semiconductor device - Google Patents
Method of fabricating semiconductor deviceInfo
- Publication number
- JPS5546582A JPS5546582A JP12087878A JP12087878A JPS5546582A JP S5546582 A JPS5546582 A JP S5546582A JP 12087878 A JP12087878 A JP 12087878A JP 12087878 A JP12087878 A JP 12087878A JP S5546582 A JPS5546582 A JP S5546582A
- Authority
- JP
- Japan
- Prior art keywords
- film
- projections
- remove
- coated
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To readily flatten the surface of a semiconductor device by coating photoresist on the entire surface when removing the projections occurred on the surface of a semiconductor substrate, removing the resist coated on the projections, and then etching to remove only the projections.
CONSTITUTION: When projections 2 are produced on the insulating film 1 coated on a semiconductor substrate, the following treatment is conducted to remove them and flatten the surfade. That is, photoresist having low viscosity for the film 1 is coated by spinning method to generate thick resist film 3-1 on the lower surface and thin resist film 3-2 on the projection 2 on the film 1. Then, light is exposed and developed on the films to thereby remove only the film 3-2 by utilizing the difference of their thickness. Then, the film 3-1 retained is etched though the film is thinned to eliminate the projections 2. Thus, when metallic wiring is provided on the film 1, no wire breakage occurs.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087878A JPS5546582A (en) | 1978-09-29 | 1978-09-29 | Method of fabricating semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087878A JPS5546582A (en) | 1978-09-29 | 1978-09-29 | Method of fabricating semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5546582A true JPS5546582A (en) | 1980-04-01 |
Family
ID=14797191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12087878A Pending JPS5546582A (en) | 1978-09-29 | 1978-09-29 | Method of fabricating semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5546582A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851856A (en) * | 1993-12-03 | 1998-12-22 | Yamaha Corporation | Manufacture of application-specific IC |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5383467A (en) * | 1976-11-30 | 1978-07-22 | Nec Corp | Production of semiconductor device |
-
1978
- 1978-09-29 JP JP12087878A patent/JPS5546582A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5383467A (en) * | 1976-11-30 | 1978-07-22 | Nec Corp | Production of semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851856A (en) * | 1993-12-03 | 1998-12-22 | Yamaha Corporation | Manufacture of application-specific IC |
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