JPS5760836A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5760836A JPS5760836A JP13559480A JP13559480A JPS5760836A JP S5760836 A JPS5760836 A JP S5760836A JP 13559480 A JP13559480 A JP 13559480A JP 13559480 A JP13559480 A JP 13559480A JP S5760836 A JPS5760836 A JP S5760836A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist film
- level
- spinning
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/18—Coating curved surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To permit photo processing of a substrate with larged diference in level, by a method wherein a resist film is applied by spinning on a substrate and corners of the difference in level which are not coated are removed by etching and are covered again by the resist film coating. CONSTITUTION:For instance, in the photo processing of a high dielectric strength IC of separated dielectric formation, a resist film 10' is applied on a substrate with an island-like convex 2 by spinning. In such case, when the difference in level is large, the corners of the convex are not covered by the resist film 10' even if resist with high viscosity is applied by spinning at low revolution speed. This substrate is plasma-etched in an atmosphere of CF4 gas with 5% of O2 being added so that the corners are made amooth. Then over the substrate a resist film 10'' is applied again and patterning is made by exposing and developing. With above method surface of a substrate with approximately 20mum difference in level can be covered with a resist film and photo processing of such substrate can be made without trouble.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13559480A JPS5760836A (en) | 1980-09-29 | 1980-09-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13559480A JPS5760836A (en) | 1980-09-29 | 1980-09-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5760836A true JPS5760836A (en) | 1982-04-13 |
Family
ID=15155464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13559480A Pending JPS5760836A (en) | 1980-09-29 | 1980-09-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5760836A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015088678A (en) * | 2013-10-31 | 2015-05-07 | 日亜化学工業株式会社 | Method for manufacturing semiconductor element |
-
1980
- 1980-09-29 JP JP13559480A patent/JPS5760836A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015088678A (en) * | 2013-10-31 | 2015-05-07 | 日亜化学工業株式会社 | Method for manufacturing semiconductor element |
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