JPS5635131A
(en)
*
|
1979-08-21 |
1981-04-07 |
Siemens Ag |
Producing high heattstability relief structure
|
JPH0368374B2
(ja)
*
|
1979-08-21 |
1991-10-28 |
Siemens Ag |
|
JPS60100143A
(ja)
*
|
1983-08-29 |
1985-06-04 |
マイクロサイ,インコーポレイテッド |
光パタ−ン化しうる誘電性組成物とその製造及び使用方法
|
JPS6088939A
(ja)
*
|
1983-10-21 |
1985-05-18 |
Shin Etsu Chem Co Ltd |
感光性組成物
|
JPS60198537A
(ja)
*
|
1984-01-24 |
1985-10-08 |
ゼネラル・エレクトリツク・カンパニイ |
ホトパタ−ニングの可能な誘電体組成物並びにその製造方法および使用方法
|
JPH0195133A
(ja)
*
|
1987-10-07 |
1989-04-13 |
Toshiba Silicone Co Ltd |
末端に光重合性有機基を有するシロキサン−アミドブロックコポリマーおよびその製造方法
|
JPH01283554A
(ja)
*
|
1988-05-11 |
1989-11-15 |
Hitachi Ltd |
耐熱感光性重合体組成物
|
JPH0292535A
(ja)
*
|
1988-09-30 |
1990-04-03 |
Hitachi Ltd |
金属とポリイミドの複合成形体
|
US5342739A
(en)
*
|
1991-02-25 |
1994-08-30 |
Chisso Corporation |
Method of preparing a negative pattern utilizing photosensitive polymer composition containing quinonediazide compound and a poly(amido)imide precursor
|
US5589319A
(en)
*
|
1992-06-25 |
1996-12-31 |
Chisso Corporation |
Photosensitive polyimide resin composition
|
US5441845A
(en)
*
|
1993-02-17 |
1995-08-15 |
Shin-Etsu Chemical Co., Ltd. |
Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone
|
US5573886A
(en)
*
|
1994-01-21 |
1996-11-12 |
Shin-Etsu Chemical Co., Ltd. |
Photosensitive resin composition comprising a polyimide precursor and method for making a polyimide film pattern from the same
|
US7485405B2
(en)
|
2004-10-07 |
2009-02-03 |
Shin-Etsu Chemical Co., Ltd. |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
|
EP1645909A2
(en)
|
2004-10-07 |
2006-04-12 |
Shin-Etsu Chemical Co., Ltd. |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
|
US7638259B2
(en)
|
2006-08-22 |
2009-12-29 |
Shin-Etsu Chemical Co., Ltd. |
Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
|
US7785766B2
(en)
|
2007-01-31 |
2010-08-31 |
Shin-Etsu Chemical Co., Ltd. |
Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film
|
EP1953183A2
(en)
|
2007-01-31 |
2008-08-06 |
Shin-Etsu Chemical Co., Ltd. |
Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film
|
US8263308B2
(en)
|
2009-03-12 |
2012-09-11 |
Shin-Etsu Chemical Co., Ltd. |
Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
|
EP2228400A1
(en)
|
2009-03-12 |
2010-09-15 |
Shin-Etsu Chemical Co., Ltd. |
Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
|
KR20100103393A
(ko)
|
2009-03-12 |
2010-09-27 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
신규 폴리이미드 실리콘 및 이것을 함유하는 감광성 수지 조성물, 및 패턴 형성 방법
|
EP2333015A2
(en)
|
2009-12-10 |
2011-06-15 |
Shin-Etsu Chemical Co., Ltd. |
Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition
|
US8673537B2
(en)
|
2009-12-10 |
2014-03-18 |
Shin-Etsu Chemical Co., Ltd. |
Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition
|
JP2011133825A
(ja)
*
|
2009-12-25 |
2011-07-07 |
Jsr Corp |
液晶配向剤、液晶配向膜および液晶表示素子
|
CN102108300A
(zh)
*
|
2009-12-25 |
2011-06-29 |
Jsr株式会社 |
液晶取向剂、液晶取向膜和液晶显示元件
|
CN105400523A
(zh)
*
|
2014-09-09 |
2016-03-16 |
Jsr株式会社 |
液晶取向剂、液晶取向膜以及液晶显示元件
|
CN109913241B
(zh)
*
|
2014-09-09 |
2022-07-26 |
Jsr株式会社 |
液晶取向剂、液晶取向膜以及液晶显示元件
|
CN109913241A
(zh)
*
|
2014-09-09 |
2019-06-21 |
Jsr株式会社 |
液晶取向剂、液晶取向膜以及液晶显示元件
|
EP3235803A1
(en)
|
2016-04-19 |
2017-10-25 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
|
KR20170119643A
(ko)
|
2016-04-19 |
2017-10-27 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
테트라카르복실산디에스테르 화합물, 폴리이미드 전구체의 중합체 및 그 제조 방법, 네거티브형 감광성 수지 조성물, 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 경화 피막 형성 방법
|
US10457779B2
(en)
|
2016-04-19 |
2019-10-29 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
|
KR20180011729A
(ko)
|
2016-07-25 |
2018-02-02 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
테트라카르복실산 디에스테르 화합물, 폴리이미드 전구체 중합체 및 그 제조 방법, 네거티브형 감광성 수지 조성물, 패턴 형성 방법 및 경화 피막 형성 방법
|
US10216085B2
(en)
|
2016-07-25 |
2019-02-26 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film
|
EP3275857A1
(en)
|
2016-07-25 |
2018-01-31 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film
|
KR20180046385A
(ko)
|
2016-10-27 |
2018-05-08 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
테트라카르복실산디에스테르 화합물, 폴리이미드 전구체의 중합체 및 그 제조 방법, 네거티브형 감광성 수지 조성물, 패턴 형성 방법, 및 경화 피막 형성 방법
|
US10203601B2
(en)
|
2016-10-27 |
2019-02-12 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
|
EP3315504A1
(en)
|
2016-10-27 |
2018-05-02 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
|
US10816900B2
(en)
|
2016-10-27 |
2020-10-27 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
|
EP3398983A1
(en)
|
2017-03-22 |
2018-11-07 |
Shin-Etsu Chemical Co., Ltd. |
Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
|
KR20180107756A
(ko)
|
2017-03-22 |
2018-10-02 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
폴리이미드 전구체의 중합체, 포지티브형 감광성 수지 조성물, 네거티브형 감광성 수지 조성물, 패턴 형성 방법, 경화 피막 형성 방법, 층간 절연막, 표면 보호막 및 전자 부품
|
US11150556B2
(en)
|
2017-03-22 |
2021-10-19 |
Shin-Etsu Chemical Co., Ltd. |
Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
|
EP3495434A1
(en)
|
2017-12-05 |
2019-06-12 |
Shin-Etsu Chemical Co., Ltd. |
Novel tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
|
KR20190066591A
(ko)
|
2017-12-05 |
2019-06-13 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
신규 테트라카르복실산이무수물, 폴리이미드 수지 및 그 제조 방법, 감광성 수지 조성물, 패턴 형성 방법 및 경화 피막 형성 방법, 층간 절연막, 표면 보호막, 전자 부품
|
US10919918B2
(en)
|
2017-12-05 |
2021-02-16 |
Shin-Etsu Chemical Co., Ltd. |
Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
|
EP3604390A1
(en)
|
2018-08-01 |
2020-02-05 |
Shin-Etsu Chemical Co., Ltd. |
Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts
|
KR20200014709A
(ko)
|
2018-08-01 |
2020-02-11 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
폴리아미드, 폴리아미드이미드, 폴리이미드 구조를 포함하는 중합체, 감광성 수지 조성물, 패턴 형성 방법, 감광성 드라이 필름 및 전기·전자 부품 보호용 피막
|
US11768434B2
(en)
|
2018-08-01 |
2023-09-26 |
Shin-Etsu Chemical Co., Ltd. |
Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts
|
EP3734362A1
(en)
|
2019-04-15 |
2020-11-04 |
Shin-Etsu Chemical Co., Ltd. |
Positive photosensitive resin composition, patterning process, method of forming cured film, interlayer insulation film, surface protective film, and electronic component
|
KR20200121253A
(ko)
|
2019-04-15 |
2020-10-23 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
포지티브형 감광성 수지 조성물, 패턴 형성 방법, 경화 피막 형성 방법, 층간 절연막, 표면 보호막, 및 전자 부품
|
EP3896114A1
(en)
|
2020-04-14 |
2021-10-20 |
Shin-Etsu Chemical Co., Ltd. |
Novel compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component
|
KR20210127595A
(ko)
|
2020-04-14 |
2021-10-22 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
신규 화합물, 폴리이미드 수지 및 그 제조 방법, 감광성 수지 조성물, 패턴 형성 방법 및 경화 피막 형성 방법, 층간 절연막, 표면 보호막, 전자 부품
|
KR20210127594A
(ko)
|
2020-04-14 |
2021-10-22 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
중합체, 감광성 수지 조성물, 패턴 형성 방법, 경화 피막 형성 방법, 층간 절연막, 표면 보호막 및 전자 부품
|
EP3896521A1
(en)
|
2020-04-14 |
2021-10-20 |
Shin-Etsu Chemical Co., Ltd. |
Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
|
US11572442B2
(en)
|
2020-04-14 |
2023-02-07 |
International Business Machines Corporation |
Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component
|
EP3951499A1
(en)
|
2020-08-04 |
2022-02-09 |
Shin-Etsu Chemical Co., Ltd. |
Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
|
KR20220017362A
(ko)
|
2020-08-04 |
2022-02-11 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
네거티브형 감광성 수지 조성물, 패턴 형성 방법, 경화 피막 형성 방법, 층간 절연막, 표면 보호막 및 전자 부품
|
EP4056627A1
(en)
|
2021-03-09 |
2022-09-14 |
Shin-Etsu Chemical Co., Ltd. |
Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin compostion, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component
|
KR20220126645A
(ko)
|
2021-03-09 |
2022-09-16 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
폴리이미드를 포함하는 중합체, 포지티브형 감광성 수지 조성물, 네거티브형 감광성 수지 조성물, 패턴 형성 방법, 경화 피막 형성 방법, 층간 절연막, 표면 보호막 및 전자 부품
|
EP4273624A1
(en)
|
2022-05-02 |
2023-11-08 |
Shin-Etsu Chemical Co., Ltd. |
Negative photosensitive resin composition, patterning process, interlayer insulating film, surface protection film, and electronic component
|