JPS5624343A - Photosensitive heat resistant polymer composition - Google Patents
Photosensitive heat resistant polymer compositionInfo
- Publication number
- JPS5624343A JPS5624343A JP9942079A JP9942079A JPS5624343A JP S5624343 A JPS5624343 A JP S5624343A JP 9942079 A JP9942079 A JP 9942079A JP 9942079 A JP9942079 A JP 9942079A JP S5624343 A JPS5624343 A JP S5624343A
- Authority
- JP
- Japan
- Prior art keywords
- kinds
- heat resistant
- diamines
- represented
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Abstract
PURPOSE: To obtain varnish having high storage stability, superior heat resistance and superior insulating properties by reacting a polyamic acid, with one or more kinds of specified isocyanates, which is a reaction product of one or more kinds of diamines selected from specified three kinds of diamines and one or more kinds of tetracarboxylic acid dianhydride.
CONSTITUTION: One or more kinds of diamines represented by formulae (1), (2), (3) [where each of R1WR5 is (substituted) hydrocarbon, i is 1W4 and m is 1W 100] and one or more kinds of tetracarboxylic acid dianhydrides represented by formula (4) (where R6 is a tetravalent group contg. ≥2C) are reacted in an org. polar solvent in an anhydrous reaction system to prepare a polyamic acid. This acid is then reacted with one or more kinds of isocyanates represented by formula (5) [where R8 is H, halogen, alkyl or alkoxy, R9 is H or CN, R10 is H or CH3, R11 is H, CH3 or phenyl, n is 1 or 2 and X is (substituted) hydrocarbon] to manufacture photosensitive heat resistant polymer varnish. This varnish has high chemical resistance and superior pattern forming power, so it is suitable for use as a highly heat resistant resist material.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9942079A JPS5624343A (en) | 1979-08-06 | 1979-08-06 | Photosensitive heat resistant polymer composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9942079A JPS5624343A (en) | 1979-08-06 | 1979-08-06 | Photosensitive heat resistant polymer composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5624343A true JPS5624343A (en) | 1981-03-07 |
Family
ID=14246971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9942079A Pending JPS5624343A (en) | 1979-08-06 | 1979-08-06 | Photosensitive heat resistant polymer composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5624343A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61203132A (en) * | 1985-02-01 | 1986-09-09 | ゼネラル・エレクトリツク・カンパニイ | Crystal silicone-imide copolymer |
JPH02154263A (en) * | 1988-12-06 | 1990-06-13 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using this photosensitive resin composition |
JPH02154265A (en) * | 1988-12-06 | 1990-06-13 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using this photosensitive resin composition |
JPH03100019A (en) * | 1989-09-13 | 1991-04-25 | Daicel Chem Ind Ltd | Polyamic acid and polyimide |
US5026788A (en) * | 1988-06-20 | 1991-06-25 | Chisso Corporation | Photosensitive polymer having thiol group |
US6329494B1 (en) * | 1998-10-30 | 2001-12-11 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive resin composition |
US6342333B1 (en) | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
-
1979
- 1979-08-06 JP JP9942079A patent/JPS5624343A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61203132A (en) * | 1985-02-01 | 1986-09-09 | ゼネラル・エレクトリツク・カンパニイ | Crystal silicone-imide copolymer |
US5026788A (en) * | 1988-06-20 | 1991-06-25 | Chisso Corporation | Photosensitive polymer having thiol group |
JPH02154263A (en) * | 1988-12-06 | 1990-06-13 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using this photosensitive resin composition |
JPH02154265A (en) * | 1988-12-06 | 1990-06-13 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using this photosensitive resin composition |
JPH03100019A (en) * | 1989-09-13 | 1991-04-25 | Daicel Chem Ind Ltd | Polyamic acid and polyimide |
US6329494B1 (en) * | 1998-10-30 | 2001-12-11 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive resin composition |
US6342333B1 (en) | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
US6773866B2 (en) | 1999-09-23 | 2004-08-10 | Hitachi Chemical Dupont Microsystems L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
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