JPS5544749A - Substrate for mounting semiconductor device - Google Patents

Substrate for mounting semiconductor device

Info

Publication number
JPS5544749A
JPS5544749A JP11821578A JP11821578A JPS5544749A JP S5544749 A JPS5544749 A JP S5544749A JP 11821578 A JP11821578 A JP 11821578A JP 11821578 A JP11821578 A JP 11821578A JP S5544749 A JPS5544749 A JP S5544749A
Authority
JP
Japan
Prior art keywords
metalized
pattern
coating layer
substrate
outside lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11821578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226185B2 (enrdf_load_html_response
Inventor
Eiji Hagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11821578A priority Critical patent/JPS5544749A/ja
Publication of JPS5544749A publication Critical patent/JPS5544749A/ja
Publication of JPS6226185B2 publication Critical patent/JPS6226185B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP11821578A 1978-09-25 1978-09-25 Substrate for mounting semiconductor device Granted JPS5544749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11821578A JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11821578A JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Publications (2)

Publication Number Publication Date
JPS5544749A true JPS5544749A (en) 1980-03-29
JPS6226185B2 JPS6226185B2 (enrdf_load_html_response) 1987-06-08

Family

ID=14731056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11821578A Granted JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Country Status (1)

Country Link
JP (1) JPS5544749A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (ja) * 1981-09-26 1983-03-30 Nec Corp 電子回路用構成体
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
JPS59211253A (ja) * 1983-05-17 1984-11-30 Matsushita Electronics Corp 電子部品パツケ−ジ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (ja) * 1981-09-26 1983-03-30 Nec Corp 電子回路用構成体
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
JPS59211253A (ja) * 1983-05-17 1984-11-30 Matsushita Electronics Corp 電子部品パツケ−ジ

Also Published As

Publication number Publication date
JPS6226185B2 (enrdf_load_html_response) 1987-06-08

Similar Documents

Publication Publication Date Title
JPS55132048A (en) Semiconductor device
JPS5240969A (en) Process for production of semiconductor device
JPS5544749A (en) Substrate for mounting semiconductor device
ATE521087T1 (de) Mehrchipmodule mit eingebetteten kondensatoren
JPS55138864A (en) Method of fabricating semiconductor assembling substrate
JPS5591835A (en) Electronic device
JPS5585042A (en) Semiconductor device
JPS5460582A (en) Electrode wiring and its forming method in semiconductor device
JPS556852A (en) Semiconductor device
JPS5318962A (en) Semiconductor package
JPS558057A (en) Semiconductor
JPS5544737A (en) Hybrid integrated circuit device
FR2520556B1 (fr) Dispositif semi-conducteur forme sur un substrat isolant
JPS53121489A (en) Semiconductor device
JPS5555546A (en) Method of wiring semiconductor device
JPS53138056A (en) Method of coating resin layer on printed circuit board metal material substrate having through hole
JPS54114973A (en) Semiconductor device
JPS53107272A (en) Film substrate for semiconductor device
JPS54158169A (en) Semiconductor device
JPS5341177A (en) Mounting method of electronic parts
JPS57184239A (en) Substrate for semiconductor device
JPS53110391A (en) Manufacture of multi-layer wiring for semiconductor device
JPS55160452A (en) Hybrid integrated circuit
JPS51142273A (en) Method of manufacturing semiconductor device
JPS5741644A (en) Preparation of recording material