JPS5544737A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS5544737A JPS5544737A JP11817278A JP11817278A JPS5544737A JP S5544737 A JPS5544737 A JP S5544737A JP 11817278 A JP11817278 A JP 11817278A JP 11817278 A JP11817278 A JP 11817278A JP S5544737 A JPS5544737 A JP S5544737A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- conductor layer
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
PURPOSE: To stably operate this device under a condition that outside circuits do not interfere, by coating this device with insulating resin, and by covering a surface of the insulating resin with conductive resin.
CONSTITUTION: An insulating substrate 4 provided with a back conductor layer 2 and a surface conductor layer 3 is melting sticked on a conductor substrate 1 in metal. A circuit element 5 of a transistor, a condenser, a coil, etc. is installed onto the conductor layer 3 on the substrate 4, and this hybrid integrated circuit device formed is coated with insulating resin 6. The whole surface of the resin 6 on a surface of this device is covered with conductive resin 7, and internal parts, etc. are shielded by the resin 7 in the substrate 1, thus ensuring action that is not interfered by means of outside circuits and is stable.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817278A JPS5544737A (en) | 1978-09-25 | 1978-09-25 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817278A JPS5544737A (en) | 1978-09-25 | 1978-09-25 | Hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5544737A true JPS5544737A (en) | 1980-03-29 |
Family
ID=14729895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11817278A Pending JPS5544737A (en) | 1978-09-25 | 1978-09-25 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5544737A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59158333U (en) * | 1983-04-11 | 1984-10-24 | 東光株式会社 | Hybrid integrated circuit device |
US5278580A (en) * | 1991-02-06 | 1994-01-11 | Rohm Co., Ltd. | Thermal head |
US9929078B2 (en) | 2016-01-14 | 2018-03-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
-
1978
- 1978-09-25 JP JP11817278A patent/JPS5544737A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59158333U (en) * | 1983-04-11 | 1984-10-24 | 東光株式会社 | Hybrid integrated circuit device |
JPH0231836Y2 (en) * | 1983-04-11 | 1990-08-28 | ||
US5278580A (en) * | 1991-02-06 | 1994-01-11 | Rohm Co., Ltd. | Thermal head |
US9929078B2 (en) | 2016-01-14 | 2018-03-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
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