JPS5568657A - Integrated circuit for microwave - Google Patents
Integrated circuit for microwaveInfo
- Publication number
- JPS5568657A JPS5568657A JP14175778A JP14175778A JPS5568657A JP S5568657 A JPS5568657 A JP S5568657A JP 14175778 A JP14175778 A JP 14175778A JP 14175778 A JP14175778 A JP 14175778A JP S5568657 A JPS5568657 A JP S5568657A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal
- hole
- recess
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a device of simple construction and high performance, by fitting a metal piece in a recess on a metal body through a perforated hole of an insulating plate, fixing the insulating plate on the metal body, and placing a circuit unit on the top of the metal piece.
CONSTITUTION: A strip line 2 of prescribed pattern in provided on the top of an alumina substrate 1 and a grounded electroconductive member 3 is coated on the bottom of the substrate to manufacture an integrated circuit substrate 4. The substrate 4 is fixed on a grounding metal plate 6. A quadrangular hole 10 is perforated through the substrate 4. A recess 11 of the same form and position as the hole 10 is provided on the metal plate 6. A metal piece 12 is tightly fitted into the recess 11 through the hole 10. Both the ends of the top of the metal plate 12 are calked to secure the substrate 4 and the metal plate 6 on each other. A semiconductor chip 13 is mounted on the top of the metal piece 12 so that the tops of the chip 13 and the substrate 4 are located on the same plane. The chip and the substrate are connected to each other through wires 14. This results in obtaining an integrated circuit device for microwave which has a simple construction, minimum grounding distance, good heat radiation and high performance.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14175778A JPS5568657A (en) | 1978-11-17 | 1978-11-17 | Integrated circuit for microwave |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14175778A JPS5568657A (en) | 1978-11-17 | 1978-11-17 | Integrated circuit for microwave |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5568657A true JPS5568657A (en) | 1980-05-23 |
Family
ID=15299477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14175778A Pending JPS5568657A (en) | 1978-11-17 | 1978-11-17 | Integrated circuit for microwave |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5568657A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5933854A (en) * | 1982-08-19 | 1984-02-23 | Matsushita Electric Ind Co Ltd | Mounting device for semiconductor |
US4835598A (en) * | 1985-06-13 | 1989-05-30 | Matsushita Electric Works, Ltd. | Wiring board |
US6620067B1 (en) | 1999-11-24 | 2003-09-16 | Honda Giken Kogyo Kabushiki Kaisha | Tensioner device |
-
1978
- 1978-11-17 JP JP14175778A patent/JPS5568657A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5933854A (en) * | 1982-08-19 | 1984-02-23 | Matsushita Electric Ind Co Ltd | Mounting device for semiconductor |
JPH0313753B2 (en) * | 1982-08-19 | 1991-02-25 | Matsushita Electric Ind Co Ltd | |
US4835598A (en) * | 1985-06-13 | 1989-05-30 | Matsushita Electric Works, Ltd. | Wiring board |
US6620067B1 (en) | 1999-11-24 | 2003-09-16 | Honda Giken Kogyo Kabushiki Kaisha | Tensioner device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3070877D1 (en) | High frequency semiconductor device on an insulating substrate | |
JPS5553446A (en) | Container of electronic component | |
JPS5568657A (en) | Integrated circuit for microwave | |
JPS57181144A (en) | Semiconductor device | |
GB1217148A (en) | Improvements in or relating to substrates for microelectronic components | |
JPS5645054A (en) | Resin sealing semiconductor device | |
JPS5561046A (en) | Packaging device for semiconductor integrated circuit | |
JPS5559746A (en) | Semiconductor device and its mounting circuit device | |
JPS53119675A (en) | Mounting structure of lsi | |
JPS5587451A (en) | Probe card | |
JPS55107251A (en) | Electronic part and its packaging construction | |
JPS56114575A (en) | Radiating body for soldering | |
JPS5544737A (en) | Hybrid integrated circuit device | |
JPS55160452A (en) | Hybrid integrated circuit | |
JPS53108372A (en) | Substrate for wireless bonding | |
JPS5414159A (en) | Manufacture for semiconductor device | |
JPS52108774A (en) | Fitting material for integrated circuit | |
JPS553657A (en) | Electronic circuit device | |
JPS5450732A (en) | Contactless ignitor | |
JPS5555549A (en) | Semiconductor device | |
JPS52146563A (en) | Semiconductor device | |
JPS56105668A (en) | Thick film hybrid ic | |
JPS5544755A (en) | Semiconductor container | |
JPS57132332A (en) | Semiconductor device | |
JPS5521109A (en) | Package for accommodating semiconductor parts |