JPS5568657A - Integrated circuit for microwave - Google Patents

Integrated circuit for microwave

Info

Publication number
JPS5568657A
JPS5568657A JP14175778A JP14175778A JPS5568657A JP S5568657 A JPS5568657 A JP S5568657A JP 14175778 A JP14175778 A JP 14175778A JP 14175778 A JP14175778 A JP 14175778A JP S5568657 A JPS5568657 A JP S5568657A
Authority
JP
Japan
Prior art keywords
substrate
metal
hole
recess
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14175778A
Other languages
Japanese (ja)
Inventor
Masayoshi Kanazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP14175778A priority Critical patent/JPS5568657A/en
Publication of JPS5568657A publication Critical patent/JPS5568657A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a device of simple construction and high performance, by fitting a metal piece in a recess on a metal body through a perforated hole of an insulating plate, fixing the insulating plate on the metal body, and placing a circuit unit on the top of the metal piece.
CONSTITUTION: A strip line 2 of prescribed pattern in provided on the top of an alumina substrate 1 and a grounded electroconductive member 3 is coated on the bottom of the substrate to manufacture an integrated circuit substrate 4. The substrate 4 is fixed on a grounding metal plate 6. A quadrangular hole 10 is perforated through the substrate 4. A recess 11 of the same form and position as the hole 10 is provided on the metal plate 6. A metal piece 12 is tightly fitted into the recess 11 through the hole 10. Both the ends of the top of the metal plate 12 are calked to secure the substrate 4 and the metal plate 6 on each other. A semiconductor chip 13 is mounted on the top of the metal piece 12 so that the tops of the chip 13 and the substrate 4 are located on the same plane. The chip and the substrate are connected to each other through wires 14. This results in obtaining an integrated circuit device for microwave which has a simple construction, minimum grounding distance, good heat radiation and high performance.
COPYRIGHT: (C)1980,JPO&Japio
JP14175778A 1978-11-17 1978-11-17 Integrated circuit for microwave Pending JPS5568657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14175778A JPS5568657A (en) 1978-11-17 1978-11-17 Integrated circuit for microwave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14175778A JPS5568657A (en) 1978-11-17 1978-11-17 Integrated circuit for microwave

Publications (1)

Publication Number Publication Date
JPS5568657A true JPS5568657A (en) 1980-05-23

Family

ID=15299477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14175778A Pending JPS5568657A (en) 1978-11-17 1978-11-17 Integrated circuit for microwave

Country Status (1)

Country Link
JP (1) JPS5568657A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933854A (en) * 1982-08-19 1984-02-23 Matsushita Electric Ind Co Ltd Mounting device for semiconductor
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
US6620067B1 (en) 1999-11-24 2003-09-16 Honda Giken Kogyo Kabushiki Kaisha Tensioner device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933854A (en) * 1982-08-19 1984-02-23 Matsushita Electric Ind Co Ltd Mounting device for semiconductor
JPH0313753B2 (en) * 1982-08-19 1991-02-25 Matsushita Electric Ind Co Ltd
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
US6620067B1 (en) 1999-11-24 2003-09-16 Honda Giken Kogyo Kabushiki Kaisha Tensioner device

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