JPS55156334A - Wire bonding method and apparatus thereof - Google Patents

Wire bonding method and apparatus thereof

Info

Publication number
JPS55156334A
JPS55156334A JP6389579A JP6389579A JPS55156334A JP S55156334 A JPS55156334 A JP S55156334A JP 6389579 A JP6389579 A JP 6389579A JP 6389579 A JP6389579 A JP 6389579A JP S55156334 A JPS55156334 A JP S55156334A
Authority
JP
Japan
Prior art keywords
wire
capillary
bonding
bonding point
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6389579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6333295B2 (enExample
Inventor
Michio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6389579A priority Critical patent/JPS55156334A/ja
Publication of JPS55156334A publication Critical patent/JPS55156334A/ja
Publication of JPS6333295B2 publication Critical patent/JPS6333295B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP6389579A 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof Granted JPS55156334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6389579A JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6389579A JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61023752A Division JPS61179548A (ja) 1986-02-07 1986-02-07 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS55156334A true JPS55156334A (en) 1980-12-05
JPS6333295B2 JPS6333295B2 (enExample) 1988-07-05

Family

ID=13242484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6389579A Granted JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55156334A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589331A (ja) * 1981-07-08 1983-01-19 Mitsubishi Electric Corp 半導体装置のワイヤボンデイング装置
US20110000951A1 (en) * 2008-03-17 2011-01-06 Kulicke And Soffa Industries, Inc. Wire payout measurement and calibration techniques for a wire bonding machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324212U (enExample) * 1989-07-19 1991-03-13

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435679A (en) * 1977-08-25 1979-03-15 Toshiba Corp Semiconductor connection method
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435679A (en) * 1977-08-25 1979-03-15 Toshiba Corp Semiconductor connection method
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589331A (ja) * 1981-07-08 1983-01-19 Mitsubishi Electric Corp 半導体装置のワイヤボンデイング装置
US20110000951A1 (en) * 2008-03-17 2011-01-06 Kulicke And Soffa Industries, Inc. Wire payout measurement and calibration techniques for a wire bonding machine
US8302841B2 (en) * 2008-03-17 2012-11-06 Kulicke And Soffa Industries Wire payout measurement and calibration techniques for a wire bonding machine

Also Published As

Publication number Publication date
JPS6333295B2 (enExample) 1988-07-05

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