JPS6333295B2 - - Google Patents

Info

Publication number
JPS6333295B2
JPS6333295B2 JP54063895A JP6389579A JPS6333295B2 JP S6333295 B2 JPS6333295 B2 JP S6333295B2 JP 54063895 A JP54063895 A JP 54063895A JP 6389579 A JP6389579 A JP 6389579A JP S6333295 B2 JPS6333295 B2 JP S6333295B2
Authority
JP
Japan
Prior art keywords
wire
bonding
clamper
point
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54063895A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55156334A (en
Inventor
Michio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6389579A priority Critical patent/JPS55156334A/ja
Publication of JPS55156334A publication Critical patent/JPS55156334A/ja
Publication of JPS6333295B2 publication Critical patent/JPS6333295B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP6389579A 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof Granted JPS55156334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6389579A JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6389579A JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61023752A Division JPS61179548A (ja) 1986-02-07 1986-02-07 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS55156334A JPS55156334A (en) 1980-12-05
JPS6333295B2 true JPS6333295B2 (enExample) 1988-07-05

Family

ID=13242484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6389579A Granted JPS55156334A (en) 1979-05-25 1979-05-25 Wire bonding method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55156334A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324212U (enExample) * 1989-07-19 1991-03-13

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589331A (ja) * 1981-07-08 1983-01-19 Mitsubishi Electric Corp 半導体装置のワイヤボンデイング装置
US8302841B2 (en) * 2008-03-17 2012-11-06 Kulicke And Soffa Industries Wire payout measurement and calibration techniques for a wire bonding machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435679A (en) * 1977-08-25 1979-03-15 Toshiba Corp Semiconductor connection method
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324212U (enExample) * 1989-07-19 1991-03-13

Also Published As

Publication number Publication date
JPS55156334A (en) 1980-12-05

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