JPS55132072A - Mos semiconductor device - Google Patents

Mos semiconductor device

Info

Publication number
JPS55132072A
JPS55132072A JP3864379A JP3864379A JPS55132072A JP S55132072 A JPS55132072 A JP S55132072A JP 3864379 A JP3864379 A JP 3864379A JP 3864379 A JP3864379 A JP 3864379A JP S55132072 A JPS55132072 A JP S55132072A
Authority
JP
Japan
Prior art keywords
film
poly
mask
gate
sio2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3864379A
Other languages
English (en)
Inventor
Yoshihisa Mizutani
Susumu Kayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3864379A priority Critical patent/JPS55132072A/ja
Publication of JPS55132072A publication Critical patent/JPS55132072A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • H01L29/78678Polycrystalline or microcrystalline silicon transistor with inverted-type structure, e.g. with bottom gate
JP3864379A 1979-03-31 1979-03-31 Mos semiconductor device Pending JPS55132072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3864379A JPS55132072A (en) 1979-03-31 1979-03-31 Mos semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3864379A JPS55132072A (en) 1979-03-31 1979-03-31 Mos semiconductor device

Publications (1)

Publication Number Publication Date
JPS55132072A true JPS55132072A (en) 1980-10-14

Family

ID=12530919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3864379A Pending JPS55132072A (en) 1979-03-31 1979-03-31 Mos semiconductor device

Country Status (1)

Country Link
JP (1) JPS55132072A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785262A (en) * 1980-11-17 1982-05-27 Toshiba Corp Manufacture of metal oxide semiconductor type semiconductor device
JPS5790977A (en) * 1980-11-27 1982-06-05 Seiko Epson Corp Double-layer gate polysilicon mos transistor
JPS57128957A (en) * 1981-02-04 1982-08-10 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof
JPS58153371A (ja) * 1982-03-08 1983-09-12 Mitsubishi Electric Corp Mosトランジスタ
JPS62141777A (ja) * 1985-12-17 1987-06-25 Oki Electric Ind Co Ltd 薄膜トランジスタの製造方法
JPH0547793A (ja) * 1991-08-08 1993-02-26 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5859444A (en) * 1991-08-08 1999-01-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6188111B1 (en) 1997-03-31 2001-02-13 Nec Corporation Dual gate semiconductor device for shortening channel length
WO2001097290A3 (en) * 2000-06-16 2002-08-15 Advanced Micro Devices Inc Buried inverted gate field-effect transistor (bigfet)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785262A (en) * 1980-11-17 1982-05-27 Toshiba Corp Manufacture of metal oxide semiconductor type semiconductor device
JPS5790977A (en) * 1980-11-27 1982-06-05 Seiko Epson Corp Double-layer gate polysilicon mos transistor
JPS57128957A (en) * 1981-02-04 1982-08-10 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof
JPS58153371A (ja) * 1982-03-08 1983-09-12 Mitsubishi Electric Corp Mosトランジスタ
JPS62141777A (ja) * 1985-12-17 1987-06-25 Oki Electric Ind Co Ltd 薄膜トランジスタの製造方法
JPH0581053B2 (ja) * 1985-12-17 1993-11-11 Oki Electric Ind Co Ltd
JPH0547793A (ja) * 1991-08-08 1993-02-26 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5859444A (en) * 1991-08-08 1999-01-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6188111B1 (en) 1997-03-31 2001-02-13 Nec Corporation Dual gate semiconductor device for shortening channel length
WO2001097290A3 (en) * 2000-06-16 2002-08-15 Advanced Micro Devices Inc Buried inverted gate field-effect transistor (bigfet)

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