JPS55110062A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55110062A
JPS55110062A JP1616579A JP1616579A JPS55110062A JP S55110062 A JPS55110062 A JP S55110062A JP 1616579 A JP1616579 A JP 1616579A JP 1616579 A JP1616579 A JP 1616579A JP S55110062 A JPS55110062 A JP S55110062A
Authority
JP
Japan
Prior art keywords
stem
rough
100w200μm
screwed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1616579A
Other languages
Japanese (ja)
Inventor
Kenji Yoshinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1616579A priority Critical patent/JPS55110062A/en
Publication of JPS55110062A publication Critical patent/JPS55110062A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent damage at pellets when they are screwed by making the stem bottom surface rough.
CONSTITUTION: Copper heatsink 9 is fitted to the center hole of thick plate 2 made of iron or iron-nickel. The bottom of an ordinary stem having screw hole 1 is made rough by providing it with lattice-shaped grooves 10. The depth of the grooves is set at about 100W200μm and their width about 100W200μm. By this structure, when a semiconductor device is screwed to a heat discharge plate, the stress can be absorbed by the rough surface and reduced, so that the ares of the stem surface is increased and heat discharge characteristics are improved.
COPYRIGHT: (C)1980,JPO&Japio
JP1616579A 1979-02-16 1979-02-16 Semiconductor device Pending JPS55110062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1616579A JPS55110062A (en) 1979-02-16 1979-02-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1616579A JPS55110062A (en) 1979-02-16 1979-02-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55110062A true JPS55110062A (en) 1980-08-25

Family

ID=11908886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1616579A Pending JPS55110062A (en) 1979-02-16 1979-02-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55110062A (en)

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