JPS5317072A - Package for semiconductor device - Google Patents
Package for semiconductor deviceInfo
- Publication number
- JPS5317072A JPS5317072A JP9111076A JP9111076A JPS5317072A JP S5317072 A JPS5317072 A JP S5317072A JP 9111076 A JP9111076 A JP 9111076A JP 9111076 A JP9111076 A JP 9111076A JP S5317072 A JPS5317072 A JP S5317072A
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- plate form
- package
- semiconductor device
- form metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To eliminate stress transmission to dielectric members and evade the occurrence of cracking by bulging the semiconductor element securing part of a metal heat sink to a convex shape, braxing a flat plate form metal member having a hole fitting to this bulged part to the lateral surface of the bulged part and further brazing a dielectric member to the circumference of the surface of the flat plate form metal member.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9111076A JPS5317072A (en) | 1976-07-30 | 1976-07-30 | Package for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9111076A JPS5317072A (en) | 1976-07-30 | 1976-07-30 | Package for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5317072A true JPS5317072A (en) | 1978-02-16 |
Family
ID=14017370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9111076A Pending JPS5317072A (en) | 1976-07-30 | 1976-07-30 | Package for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5317072A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59131163U (en) * | 1983-02-23 | 1984-09-03 | 日本特殊陶業株式会社 | semiconductor container |
EP0654820A2 (en) * | 1993-11-08 | 1995-05-24 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Semiconductor module |
-
1976
- 1976-07-30 JP JP9111076A patent/JPS5317072A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59131163U (en) * | 1983-02-23 | 1984-09-03 | 日本特殊陶業株式会社 | semiconductor container |
JPS6331394Y2 (en) * | 1983-02-23 | 1988-08-22 | ||
EP0654820A2 (en) * | 1993-11-08 | 1995-05-24 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Semiconductor module |
EP0654820A3 (en) * | 1993-11-08 | 1995-10-11 | Eupec Gmbh & Co Kg | Semiconductor module. |
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