JPS55127038A - Stem and semiconductor device using the same - Google Patents

Stem and semiconductor device using the same

Info

Publication number
JPS55127038A
JPS55127038A JP3443279A JP3443279A JPS55127038A JP S55127038 A JPS55127038 A JP S55127038A JP 3443279 A JP3443279 A JP 3443279A JP 3443279 A JP3443279 A JP 3443279A JP S55127038 A JPS55127038 A JP S55127038A
Authority
JP
Japan
Prior art keywords
heat sink
flange
stem
pellet
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3443279A
Other languages
Japanese (ja)
Inventor
Atsushi Sasayama
Kenji Akeyama
Usuke Enomoto
Haruo Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3443279A priority Critical patent/JPS55127038A/en
Publication of JPS55127038A publication Critical patent/JPS55127038A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent a pellet from cracking even if its mounting plate is comparatively warped by providing a gas between a flange and a heat sink, around the upper and/or lower part of the inserted cylindrical surface of the heat sink.
CONSTITUTION: A stem 1 consists of a flange 2 and a heat sink 3 inserted into the hole in the center of the flange 2. Since the lower part of the hole of the flange 2 is enlarged, and only the total cylindrical surface of the upper part of the flange contacts with the heat sink 3, a gap 9 is formed between the lower cylindrical surface of the heat sink 3 and the lower inner wall of the hole. A pellet 4 is mounted on the upper surface of the heat sink 3. Thus, when the stem 1 is fixed to a mounting plate 6, even if the plate 6 is warped, no great bending load is placed on the heat sink 3, so that the pellet mounted on the upper surface of the heat sink 3 is practically prevented from being cracked.
COPYRIGHT: (C)1980,JPO&Japio
JP3443279A 1979-03-26 1979-03-26 Stem and semiconductor device using the same Pending JPS55127038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3443279A JPS55127038A (en) 1979-03-26 1979-03-26 Stem and semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3443279A JPS55127038A (en) 1979-03-26 1979-03-26 Stem and semiconductor device using the same

Publications (1)

Publication Number Publication Date
JPS55127038A true JPS55127038A (en) 1980-10-01

Family

ID=12414051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3443279A Pending JPS55127038A (en) 1979-03-26 1979-03-26 Stem and semiconductor device using the same

Country Status (1)

Country Link
JP (1) JPS55127038A (en)

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