JPS55107250A - Electronic part, electronic part module and lead frame used for them - Google Patents
Electronic part, electronic part module and lead frame used for themInfo
- Publication number
- JPS55107250A JPS55107250A JP1335779A JP1335779A JPS55107250A JP S55107250 A JPS55107250 A JP S55107250A JP 1335779 A JP1335779 A JP 1335779A JP 1335779 A JP1335779 A JP 1335779A JP S55107250 A JPS55107250 A JP S55107250A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- tab
- heat radiating
- cut
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1335779A JPS55107250A (en) | 1979-02-09 | 1979-02-09 | Electronic part, electronic part module and lead frame used for them |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1335779A JPS55107250A (en) | 1979-02-09 | 1979-02-09 | Electronic part, electronic part module and lead frame used for them |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63010668A Division JPS63296258A (ja) | 1988-01-22 | 1988-01-22 | 電子部品の実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55107250A true JPS55107250A (en) | 1980-08-16 |
JPS6329413B2 JPS6329413B2 (ja) | 1988-06-14 |
Family
ID=11830841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1335779A Granted JPS55107250A (en) | 1979-02-09 | 1979-02-09 | Electronic part, electronic part module and lead frame used for them |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55107250A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61150356A (ja) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | 樹脂封止型半導体装置の平面実装形態 |
JPS634661A (ja) * | 1986-06-25 | 1988-01-09 | Hitachi Ltd | 電子装置 |
JPS63296258A (ja) * | 1988-01-22 | 1988-12-02 | Hitachi Ltd | 電子部品の実装構造 |
EP1526571A2 (en) * | 2003-10-21 | 2005-04-27 | Delphi Technologies, Inc. | Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor |
JP2008296125A (ja) * | 2007-05-31 | 2008-12-11 | Hitachi Koki Co Ltd | 遠心分離機 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4421066Y1 (ja) * | 1966-07-20 | 1969-09-08 | ||
JPS4964373A (ja) * | 1972-06-23 | 1974-06-21 | ||
JPS511072A (ja) * | 1974-06-21 | 1976-01-07 | Fujitsu Ltd | Jushifujigatahandotaisochino seizohoho |
JPS5145977A (ja) * | 1974-10-17 | 1976-04-19 | Nippon Electric Co | Jushifushigatahandotaisochi |
JPS53108368A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture |
-
1979
- 1979-02-09 JP JP1335779A patent/JPS55107250A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4421066Y1 (ja) * | 1966-07-20 | 1969-09-08 | ||
JPS4964373A (ja) * | 1972-06-23 | 1974-06-21 | ||
JPS511072A (ja) * | 1974-06-21 | 1976-01-07 | Fujitsu Ltd | Jushifujigatahandotaisochino seizohoho |
JPS5145977A (ja) * | 1974-10-17 | 1976-04-19 | Nippon Electric Co | Jushifushigatahandotaisochi |
JPS53108368A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61150356A (ja) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | 樹脂封止型半導体装置の平面実装形態 |
JPH0320067B2 (ja) * | 1984-12-25 | 1991-03-18 | Tokyo Shibaura Electric Co | |
JPS634661A (ja) * | 1986-06-25 | 1988-01-09 | Hitachi Ltd | 電子装置 |
JPS63296258A (ja) * | 1988-01-22 | 1988-12-02 | Hitachi Ltd | 電子部品の実装構造 |
EP1526571A2 (en) * | 2003-10-21 | 2005-04-27 | Delphi Technologies, Inc. | Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor |
EP1526571A3 (en) * | 2003-10-21 | 2011-06-15 | Delphi Technologies, Inc. | Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor |
JP2008296125A (ja) * | 2007-05-31 | 2008-12-11 | Hitachi Koki Co Ltd | 遠心分離機 |
Also Published As
Publication number | Publication date |
---|---|
JPS6329413B2 (ja) | 1988-06-14 |
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