JPS511072A - Jushifujigatahandotaisochino seizohoho - Google Patents
Jushifujigatahandotaisochino seizohohoInfo
- Publication number
- JPS511072A JPS511072A JP7100674A JP7100674A JPS511072A JP S511072 A JPS511072 A JP S511072A JP 7100674 A JP7100674 A JP 7100674A JP 7100674 A JP7100674 A JP 7100674A JP S511072 A JPS511072 A JP S511072A
- Authority
- JP
- Japan
- Prior art keywords
- jushifujigatahandotaisochino
- seizohoho
- jushifujigatahandotaisochino seizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7100674A JPS511072A (ja) | 1974-06-21 | 1974-06-21 | Jushifujigatahandotaisochino seizohoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7100674A JPS511072A (ja) | 1974-06-21 | 1974-06-21 | Jushifujigatahandotaisochino seizohoho |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS511072A true JPS511072A (ja) | 1976-01-07 |
JPS5436835B2 JPS5436835B2 (ja) | 1979-11-12 |
Family
ID=13447974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7100674A Granted JPS511072A (ja) | 1974-06-21 | 1974-06-21 | Jushifujigatahandotaisochino seizohoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS511072A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571047A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Lead frame for resin mold |
JPS55107250A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part, electronic part module and lead frame used for them |
JPS60193348A (ja) * | 1984-03-15 | 1985-10-01 | Toshiba Corp | 半導体製造装置 |
JPH0360049A (ja) * | 1989-07-27 | 1991-03-15 | Fujitsu Ltd | 集積回路装置の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444441A (en) * | 1965-06-18 | 1969-05-13 | Motorola Inc | Semiconductor devices including lead and plastic housing structure suitable for automated process construction |
US3795492A (en) * | 1970-10-09 | 1974-03-05 | Motorola Inc | Lanced and relieved lead strips |
-
1974
- 1974-06-21 JP JP7100674A patent/JPS511072A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444441A (en) * | 1965-06-18 | 1969-05-13 | Motorola Inc | Semiconductor devices including lead and plastic housing structure suitable for automated process construction |
US3795492A (en) * | 1970-10-09 | 1974-03-05 | Motorola Inc | Lanced and relieved lead strips |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571047A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Lead frame for resin mold |
JPS6231496B2 (ja) * | 1978-11-24 | 1987-07-08 | Hitachi Ltd | |
JPS55107250A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part, electronic part module and lead frame used for them |
JPS6329413B2 (ja) * | 1979-02-09 | 1988-06-14 | Hitachi Ltd | |
JPS60193348A (ja) * | 1984-03-15 | 1985-10-01 | Toshiba Corp | 半導体製造装置 |
JPH0360049A (ja) * | 1989-07-27 | 1991-03-15 | Fujitsu Ltd | 集積回路装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5436835B2 (ja) | 1979-11-12 |
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