JPS55105357A - Mis semiconductor device and its manufacture - Google Patents
Mis semiconductor device and its manufactureInfo
- Publication number
- JPS55105357A JPS55105357A JP1241079A JP1241079A JPS55105357A JP S55105357 A JPS55105357 A JP S55105357A JP 1241079 A JP1241079 A JP 1241079A JP 1241079 A JP1241079 A JP 1241079A JP S55105357 A JPS55105357 A JP S55105357A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- layers
- silicon
- insulating
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Abstract
PURPOSE:To obtain a MIS device with a large scale integration by a simple process by providing amorphous or polycrystal silicon layer to the selected opening of insulating film on the silicon substrate and by forming SiO2 film on the surface of said layer by oxidizing it. CONSTITUTION:The insulating thin layers 4 surrounded by the insulating film 3 are arranged in the form of a matrix on the n-type silicon substrate 2, Mo masks 5, 6 are formed to selectively give the resist mask 7 to the layer 4. After the insulating layer 4 is opened, the mask 7 is removed, and the opening is covered with amorphous or polycrystal silicon. Next ions are implated into the said silicon layer to make it p-type ones 13, 14, and Mo masks 5, 6 are removed. The surface of the layers 13, 14 are oxidized, silicon layers 19, 21, insulating layers 20, 22, and p-type layer 23 are formed, the metal layer 24 is provided in the lateral direction on the layers 3, 30, 22 last. In this way, a MIS device with a large scale integration, in which the storage elements that consist of the MISFETs and capacity elements are arranged in the form of a matrix, can be obtained by a simple process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1241079A JPS55105357A (en) | 1979-02-06 | 1979-02-06 | Mis semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1241079A JPS55105357A (en) | 1979-02-06 | 1979-02-06 | Mis semiconductor device and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55105357A true JPS55105357A (en) | 1980-08-12 |
Family
ID=11804482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1241079A Pending JPS55105357A (en) | 1979-02-06 | 1979-02-06 | Mis semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55105357A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59113659A (en) * | 1982-12-20 | 1984-06-30 | Toshiba Corp | Mos dynamic memory |
-
1979
- 1979-02-06 JP JP1241079A patent/JPS55105357A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59113659A (en) * | 1982-12-20 | 1984-06-30 | Toshiba Corp | Mos dynamic memory |
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