JPS5495184A - Resin seal-type diode - Google Patents

Resin seal-type diode

Info

Publication number
JPS5495184A
JPS5495184A JP312478A JP312478A JPS5495184A JP S5495184 A JPS5495184 A JP S5495184A JP 312478 A JP312478 A JP 312478A JP 312478 A JP312478 A JP 312478A JP S5495184 A JPS5495184 A JP S5495184A
Authority
JP
Japan
Prior art keywords
chip
caused
lead
cup
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP312478A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP312478A priority Critical patent/JPS5495184A/en
Publication of JPS5495184A publication Critical patent/JPS5495184A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent effectively the surface processing material, which are applied for the purpose of stabilizing the surface of a chip, from flowing to the external, by making one lead electrode of the first and the second leads, which are caused to adhere to both main faces of the diode chip, into a cup form surrounding the circumference side face of the chip.
CONSTITUTION: Lead electrode 10a of the first lead 11a which is caused to adhere to one main face of diode chip 1 is formed into a cup form so that electrode 10a may surround the circumference side face of chip 1. The size of lead electrode 10b of the second lead 11b which is caused to ahere to the opposite-side main face of chip 1 is set to an external form larger than chip 1. Next, these electrodes 10a and 10b are caused to adhere to both main faces of chip 1 by solders 4a and 4b, and a surface processing material is flowed into cup-shaped electrode 10a by injector 20 to form surface protective layer 5. Thus, the surface processing material is provented from flowing to the external, and cup-shaped electrode 10a has the function of a heat-radiation fin.
COPYRIGHT: (C)1979,JPO&Japio
JP312478A 1978-01-13 1978-01-13 Resin seal-type diode Pending JPS5495184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP312478A JPS5495184A (en) 1978-01-13 1978-01-13 Resin seal-type diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP312478A JPS5495184A (en) 1978-01-13 1978-01-13 Resin seal-type diode

Publications (1)

Publication Number Publication Date
JPS5495184A true JPS5495184A (en) 1979-07-27

Family

ID=11548601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP312478A Pending JPS5495184A (en) 1978-01-13 1978-01-13 Resin seal-type diode

Country Status (1)

Country Link
JP (1) JPS5495184A (en)

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