JPS54149575A - Method and device for wafer division - Google Patents

Method and device for wafer division

Info

Publication number
JPS54149575A
JPS54149575A JP5764778A JP5764778A JPS54149575A JP S54149575 A JPS54149575 A JP S54149575A JP 5764778 A JP5764778 A JP 5764778A JP 5764778 A JP5764778 A JP 5764778A JP S54149575 A JPS54149575 A JP S54149575A
Authority
JP
Japan
Prior art keywords
wafer
scribing
grooves
semiconductor
momently
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5764778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS617021B2 (cs
Inventor
Seiichi Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5764778A priority Critical patent/JPS54149575A/ja
Publication of JPS54149575A publication Critical patent/JPS54149575A/ja
Publication of JPS617021B2 publication Critical patent/JPS617021B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP5764778A 1978-05-17 1978-05-17 Method and device for wafer division Granted JPS54149575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5764778A JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5764778A JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Publications (2)

Publication Number Publication Date
JPS54149575A true JPS54149575A (en) 1979-11-22
JPS617021B2 JPS617021B2 (cs) 1986-03-03

Family

ID=13061680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5764778A Granted JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Country Status (1)

Country Link
JP (1) JPS54149575A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143146A (ja) * 2016-02-09 2017-08-17 株式会社ディスコ 切削装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204583U (cs) * 1986-06-17 1987-12-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143146A (ja) * 2016-02-09 2017-08-17 株式会社ディスコ 切削装置
KR20170094495A (ko) * 2016-02-09 2017-08-18 가부시기가이샤 디스코 절삭 장치

Also Published As

Publication number Publication date
JPS617021B2 (cs) 1986-03-03

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