JPS617021B2 - - Google Patents

Info

Publication number
JPS617021B2
JPS617021B2 JP5764778A JP5764778A JPS617021B2 JP S617021 B2 JPS617021 B2 JP S617021B2 JP 5764778 A JP5764778 A JP 5764778A JP 5764778 A JP5764778 A JP 5764778A JP S617021 B2 JPS617021 B2 JP S617021B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5764778A
Other languages
Japanese (ja)
Other versions
JPS54149575A (en
Inventor
Seiichi Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5764778A priority Critical patent/JPS54149575A/ja
Publication of JPS54149575A publication Critical patent/JPS54149575A/ja
Publication of JPS617021B2 publication Critical patent/JPS617021B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP5764778A 1978-05-17 1978-05-17 Method and device for wafer division Granted JPS54149575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5764778A JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5764778A JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Publications (2)

Publication Number Publication Date
JPS54149575A JPS54149575A (en) 1979-11-22
JPS617021B2 true JPS617021B2 (cs) 1986-03-03

Family

ID=13061680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5764778A Granted JPS54149575A (en) 1978-05-17 1978-05-17 Method and device for wafer division

Country Status (1)

Country Link
JP (1) JPS54149575A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204583U (cs) * 1986-06-17 1987-12-26

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6556066B2 (ja) * 2016-02-09 2019-08-07 株式会社ディスコ 切削装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204583U (cs) * 1986-06-17 1987-12-26

Also Published As

Publication number Publication date
JPS54149575A (en) 1979-11-22

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