JPS54146955A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS54146955A JPS54146955A JP5576878A JP5576878A JPS54146955A JP S54146955 A JPS54146955 A JP S54146955A JP 5576878 A JP5576878 A JP 5576878A JP 5576878 A JP5576878 A JP 5576878A JP S54146955 A JPS54146955 A JP S54146955A
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- face
- wafer
- finishing
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To make the finishing thickness uniform and shorten the polishing time by providing previously grooves on the reverse face and finishing the semiconductor wafer into a desired thickness by mechanical polishing when the thickness of the semiconductor wafer is made small by eliminating the reverse face.
CONSTITUTION: After many semiconductor elements 2 are formed on one face of Si wafer 1, plural rows of groove 3 are formed laterally and longitudinally on the other face by a dicing saw. At this time, the interval of grooves is defined as a pitch such as 10mm, and grooves are approximately 2mm wide, and the depth is shallower than the final finishing thickness by approximately 10μm. After that, this face is polished mechanically to make the thickness of wafer 1 into a desired one. Thus, polishing materials are distributed uniformly on the surface of wafer 1 at a polishing time, and the finishing precision is improved, and the polishing time is shortened by approximately 30%.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5576878A JPS54146955A (en) | 1978-05-10 | 1978-05-10 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5576878A JPS54146955A (en) | 1978-05-10 | 1978-05-10 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54146955A true JPS54146955A (en) | 1979-11-16 |
Family
ID=13008036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5576878A Pending JPS54146955A (en) | 1978-05-10 | 1978-05-10 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54146955A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5489555A (en) * | 1992-04-16 | 1996-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a photoelectric conversion device |
-
1978
- 1978-05-10 JP JP5576878A patent/JPS54146955A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5489555A (en) * | 1992-04-16 | 1996-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a photoelectric conversion device |
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