JPS5295581A - Sputiering apparatus - Google Patents

Sputiering apparatus

Info

Publication number
JPS5295581A
JPS5295581A JP1301576A JP1301576A JPS5295581A JP S5295581 A JPS5295581 A JP S5295581A JP 1301576 A JP1301576 A JP 1301576A JP 1301576 A JP1301576 A JP 1301576A JP S5295581 A JPS5295581 A JP S5295581A
Authority
JP
Japan
Prior art keywords
target
sputiering
taret
furface
economically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1301576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5527627B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Takashi Misumi
Naokichi Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP1301576A priority Critical patent/JPS5295581A/ja
Publication of JPS5295581A publication Critical patent/JPS5295581A/ja
Publication of JPS5527627B2 publication Critical patent/JPS5527627B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP1301576A 1976-02-09 1976-02-09 Sputiering apparatus Granted JPS5295581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1301576A JPS5295581A (en) 1976-02-09 1976-02-09 Sputiering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1301576A JPS5295581A (en) 1976-02-09 1976-02-09 Sputiering apparatus

Publications (2)

Publication Number Publication Date
JPS5295581A true JPS5295581A (en) 1977-08-11
JPS5527627B2 JPS5527627B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-07-22

Family

ID=11821319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1301576A Granted JPS5295581A (en) 1976-02-09 1976-02-09 Sputiering apparatus

Country Status (1)

Country Link
JP (1) JPS5295581A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113858U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-02-24 1977-08-30
JPS52156185A (en) * 1976-06-21 1977-12-26 Makoto Katsurai Horizontalltype discharge apparatus with cross magnetic field
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus
JPS549176A (en) * 1977-06-23 1979-01-23 Ulvac Corp Sputtering method for forming unform film and evaporation film
JPS55155866U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-04-20 1980-11-10
JPS5967369A (ja) * 1982-09-03 1984-04-17 バリアン．アソシエイツ・インコ−ポレイテッド マグネトロン飛着装置
JPS621865A (ja) * 1985-06-25 1987-01-07 Matsushita Electric Ind Co Ltd マグネトロンスパツタ装置
EP1408136A1 (en) 2002-09-19 2004-04-14 Kabushiki Kaisha Kobe Seiko Sho Rod target for arc evaporation source, manufacturing method therefor, and arc deposition device
US8741115B2 (en) 2005-03-16 2014-06-03 Bh5773 Ltd Sputtering devices and methods
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
WO2018003615A1 (ja) * 2016-06-29 2018-01-04 株式会社アルバック スパッタリング装置用成膜ユニット
US11871828B2 (en) 2016-03-24 2024-01-16 Dyson Technology Limited Attachment for a handheld appliance
US12295472B2 (en) 2016-03-24 2025-05-13 Dyson Technology Limited Attachment for a handheld appliance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186083A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-12-16 1976-07-28 Airco Inc

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186083A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-12-16 1976-07-28 Airco Inc

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus
JPS52113858U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-02-24 1977-08-30
JPS52156185A (en) * 1976-06-21 1977-12-26 Makoto Katsurai Horizontalltype discharge apparatus with cross magnetic field
JPS549176A (en) * 1977-06-23 1979-01-23 Ulvac Corp Sputtering method for forming unform film and evaporation film
JPS55155866U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-04-20 1980-11-10
JPS5967369A (ja) * 1982-09-03 1984-04-17 バリアン．アソシエイツ・インコ−ポレイテッド マグネトロン飛着装置
JPS621865A (ja) * 1985-06-25 1987-01-07 Matsushita Electric Ind Co Ltd マグネトロンスパツタ装置
US7029560B2 (en) * 2002-09-19 2006-04-18 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Rod target for arc evaporation source, manufacturing method therefor, and arc deposition device
EP1408136A1 (en) 2002-09-19 2004-04-14 Kabushiki Kaisha Kobe Seiko Sho Rod target for arc evaporation source, manufacturing method therefor, and arc deposition device
US8741115B2 (en) 2005-03-16 2014-06-03 Bh5773 Ltd Sputtering devices and methods
US9583319B2 (en) 2005-03-16 2017-02-28 Bh5773 Ltd Sputtering devices and methods
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
US11871828B2 (en) 2016-03-24 2024-01-16 Dyson Technology Limited Attachment for a handheld appliance
US12295472B2 (en) 2016-03-24 2025-05-13 Dyson Technology Limited Attachment for a handheld appliance
WO2018003615A1 (ja) * 2016-06-29 2018-01-04 株式会社アルバック スパッタリング装置用成膜ユニット
JP6271822B1 (ja) * 2016-06-29 2018-01-31 株式会社アルバック スパッタリング装置用成膜ユニット
CN109415802A (zh) * 2016-06-29 2019-03-01 株式会社爱发科 溅射装置用成膜单元
US10770275B2 (en) 2016-06-29 2020-09-08 Ulvac, Inc. Film forming unit for sputtering apparatus

Also Published As

Publication number Publication date
JPS5527627B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-07-22

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