JPS5391083A - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
JPS5391083A
JPS5391083A JP594277A JP594277A JPS5391083A JP S5391083 A JPS5391083 A JP S5391083A JP 594277 A JP594277 A JP 594277A JP 594277 A JP594277 A JP 594277A JP S5391083 A JPS5391083 A JP S5391083A
Authority
JP
Japan
Prior art keywords
substrate
base board
sputtering apparatus
equipping
moreover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP594277A
Other languages
Japanese (ja)
Inventor
Tatsu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP594277A priority Critical patent/JPS5391083A/en
Publication of JPS5391083A publication Critical patent/JPS5391083A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To carry out stable sputtering and to produce good thin film on substrate, by equipping continuously formed base board, be able to transfer the substrate between left and right vacuum space room and moreover, providing the surface of base board facing parallel to the target.
JP594277A 1977-01-24 1977-01-24 Sputtering apparatus Pending JPS5391083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP594277A JPS5391083A (en) 1977-01-24 1977-01-24 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP594277A JPS5391083A (en) 1977-01-24 1977-01-24 Sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS5391083A true JPS5391083A (en) 1978-08-10

Family

ID=11624943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP594277A Pending JPS5391083A (en) 1977-01-24 1977-01-24 Sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS5391083A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258975A (en) * 1988-12-22 1990-10-19 Fuji Photo Film Co Ltd Device and method for sputtering
JPH03219067A (en) * 1989-02-15 1991-09-26 Fuji Photo Film Co Ltd Method and device for sputtering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258975A (en) * 1988-12-22 1990-10-19 Fuji Photo Film Co Ltd Device and method for sputtering
JPH03219067A (en) * 1989-02-15 1991-09-26 Fuji Photo Film Co Ltd Method and device for sputtering

Similar Documents

Publication Publication Date Title
JPS52113379A (en) Vacuum evaporation
AU512418B2 (en) Thin film microcircuit board
IT1061594B (en) PROCEDURE FOR THE APPLICATION OF AN ANTI-REFLECTION COATING ON PLASTIC SUBSTRATES, IN PARTICULAR LENSES
JPS5391083A (en) Sputtering apparatus
JPS53135840A (en) Metal coating method for non-electroconductive material
JPS51126665A (en) Vacuum cup adhesion equipment
JPS5265183A (en) Production process of thin film of compounds
JPS5385170A (en) Soft x-ray transfer mask
JPS5259078A (en) Continuous sputtering apparatus
JPS5219785A (en) Preparation of plastic laminate
JPS5265184A (en) Eqipment for simultaneous sputtering at both surface
JPS5317583A (en) Process for forming vacuum evaporation layer on largeesized substrate surface
JPS52114632A (en) Pressure sensitive adhesive tape or sheet
JPS52110739A (en) Method of fitting an article having sticking plate
JPS5397041A (en) Thin film coater
JPS525682A (en) Sputtering apparatus for long length substrates
JPS5392391A (en) Continuous evaporating apparatus
JPS5310394A (en) Production of diamond thin films
JPS5441690A (en) Elastic surface wave unit
JPS5258081A (en) Apparatus for attaching thin film
JPS5384563A (en) Thin film pattern forming method
JPS5349950A (en) Semiconductor device
JPS53101270A (en) Substraet for semiconductor device
JPS5355142A (en) Electrode forming method in full surface mirror typeliquid crystaldisplay device
JPS52153411A (en) Production of electric substrate