JPS5259078A - Continuous sputtering apparatus - Google Patents

Continuous sputtering apparatus

Info

Publication number
JPS5259078A
JPS5259078A JP13600575A JP13600575A JPS5259078A JP S5259078 A JPS5259078 A JP S5259078A JP 13600575 A JP13600575 A JP 13600575A JP 13600575 A JP13600575 A JP 13600575A JP S5259078 A JPS5259078 A JP S5259078A
Authority
JP
Japan
Prior art keywords
sputtering apparatus
continuous sputtering
continuous
equipping
operate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13600575A
Other languages
Japanese (ja)
Inventor
Taiji Hiraga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13600575A priority Critical patent/JPS5259078A/en
Publication of JPS5259078A publication Critical patent/JPS5259078A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:Continuous sputtering apparatus, equipping target electrode moving mechanism. able to operate at outside of cell, in order to form thin coating of metal or insulating material on the surface of base plate.
JP13600575A 1975-11-11 1975-11-11 Continuous sputtering apparatus Pending JPS5259078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13600575A JPS5259078A (en) 1975-11-11 1975-11-11 Continuous sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13600575A JPS5259078A (en) 1975-11-11 1975-11-11 Continuous sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS5259078A true JPS5259078A (en) 1977-05-16

Family

ID=15164952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13600575A Pending JPS5259078A (en) 1975-11-11 1975-11-11 Continuous sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS5259078A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012143110A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach High power impulse magnetron sputtering method providing enhanced ionization of the sputtered particles and apparatus for its implementation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012143110A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach High power impulse magnetron sputtering method providing enhanced ionization of the sputtered particles and apparatus for its implementation

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