JPS549176A - Sputtering method for forming unform film and evaporation film - Google Patents

Sputtering method for forming unform film and evaporation film

Info

Publication number
JPS549176A
JPS549176A JP7387677A JP7387677A JPS549176A JP S549176 A JPS549176 A JP S549176A JP 7387677 A JP7387677 A JP 7387677A JP 7387677 A JP7387677 A JP 7387677A JP S549176 A JPS549176 A JP S549176A
Authority
JP
Japan
Prior art keywords
film
unform
forming
sputtering method
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7387677A
Other languages
Japanese (ja)
Other versions
JPS629669B2 (en
Inventor
Chikara Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP7387677A priority Critical patent/JPS549176A/en
Publication of JPS549176A publication Critical patent/JPS549176A/en
Publication of JPS629669B2 publication Critical patent/JPS629669B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To provide a sound evaporation film uniform in the thickness and quality with the substrate so arranged than nay point on the substrate can be sputtered with the target within the range of the same phase in the local magnetic field thereon.
JP7387677A 1977-06-23 1977-06-23 Sputtering method for forming unform film and evaporation film Granted JPS549176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7387677A JPS549176A (en) 1977-06-23 1977-06-23 Sputtering method for forming unform film and evaporation film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7387677A JPS549176A (en) 1977-06-23 1977-06-23 Sputtering method for forming unform film and evaporation film

Publications (2)

Publication Number Publication Date
JPS549176A true JPS549176A (en) 1979-01-23
JPS629669B2 JPS629669B2 (en) 1987-03-02

Family

ID=13530825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7387677A Granted JPS549176A (en) 1977-06-23 1977-06-23 Sputtering method for forming unform film and evaporation film

Country Status (1)

Country Link
JP (1) JPS549176A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227437A (en) * 1983-09-28 1985-11-12 Yokogawa Hewlett Packard Ltd Interface for treating integrated circuit
US6036824A (en) * 1985-11-12 2000-03-14 Magnetic Media Development Llc Magnetic recording disk sputtering process and apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186083A (en) * 1974-12-16 1976-07-28 Airco Inc
JPS5295581A (en) * 1976-02-09 1977-08-11 Anelva Corp Sputiering apparatus
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186083A (en) * 1974-12-16 1976-07-28 Airco Inc
JPS5295581A (en) * 1976-02-09 1977-08-11 Anelva Corp Sputiering apparatus
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227437A (en) * 1983-09-28 1985-11-12 Yokogawa Hewlett Packard Ltd Interface for treating integrated circuit
JPH0566733B2 (en) * 1983-09-28 1993-09-22 Hewlett Packard Co
US6036824A (en) * 1985-11-12 2000-03-14 Magnetic Media Development Llc Magnetic recording disk sputtering process and apparatus

Also Published As

Publication number Publication date
JPS629669B2 (en) 1987-03-02

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