WO2018003615A1 - スパッタリング装置用成膜ユニット - Google Patents
スパッタリング装置用成膜ユニット Download PDFInfo
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- WO2018003615A1 WO2018003615A1 PCT/JP2017/022797 JP2017022797W WO2018003615A1 WO 2018003615 A1 WO2018003615 A1 WO 2018003615A1 JP 2017022797 W JP2017022797 W JP 2017022797W WO 2018003615 A1 WO2018003615 A1 WO 2018003615A1
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- target
- support plate
- targets
- axis direction
- supply pipe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Definitions
- the present invention relates to a film forming unit for sputtering apparatus, and more particularly to a magnetron sputtering apparatus in which a target is reciprocated with respect to a magnet unit.
- Patent Document 1 This type of film forming unit for a sputtering apparatus is known from Patent Document 1, for example.
- This is provided with a box-shaped casing (displacement part) mounted on the inner wall surface of the vacuum chamber where film formation is performed, and a displacement plate is provided on the side of the casing facing the inside of the vacuum chamber.
- a backing plate having a target as a cathode bonded to one surface is fixed to the displacement plate via a support.
- a magnet unit that is located inside an opening provided in the displacement plate and that causes a leakage magnetic field to act on the target surface is fixedly disposed in the support.
- the inside of the casing is divided into two chambers by a partition wall, and one chamber communicates with the space on the target side through a through hole opened in the casing, that is, a vacuum chamber in which film formation processing is performed by evacuation.
- the other chamber is provided with a drive motor, the drive shaft of the drive motor passes through the partition wall and protrudes into one chamber, a connecting rod is provided at the tip of the protruding drive shaft, and the connecting rod is connected to the displacement plate. ing.
- the drive motor is driven, the backing plate fixed to the displacement plate via the support plate, and thus the target moves relative to the magnet unit.
- a rare gas for discharge or reactive gas during reactive sputtering is introduced into the vacuum chamber, and the target is moved while the target is sputtered by applying a predetermined power having a negative potential, for example.
- the relative position of the magnet unit and the deposition preventing plate (anode) provided in front of the target facing the inside of the vacuum chamber does not change, and changes in plasma state such as plasma position and density on the surface of the target can be suppressed.
- the present invention does not require the processing of installing a refrigerant supply pipe and a discharge pipe for the vacuum chamber without impairing the function that the target is movable relative to the magnet unit. It is an object of the present invention to provide a film forming unit for a sputtering apparatus having a structure and good maintainability.
- a support plate that is detachably attached to the opening of the vacuum chamber, and a target having a backing plate bonded to the lower surface on one side of the support plate, and a backing plate
- the film forming unit for a sputtering apparatus of the present invention having a magnet unit that is fixedly arranged between a plate and a support plate and causes a leakage magnetic field to act on the target is used while the target is sputtered by applying power to the target from a sputtering power source.
- a supply pipe and a discharge pipe for the refrigerant communicating with the refrigerant passage formed in the backing plate are provided on the backing plate.
- a long slit hole is opened in the support plate in the reciprocating direction of the target through which the pipe and the discharge pipe are inserted.
- a cap body is provided on the lower surface of the supply pipe and the discharge pipe including the slit hole and the portions protruding downward from the slit hole of the supply pipe and the discharge pipe are hermetically sealed.
- a bellows pipe is extrapolated to each of these parts, and a drive part of the drive means is connected to at least one of the supply pipe and the discharge pipe.
- the backing plate since the refrigerant can be circulated, the film forming unit can be easily maintained with a simple configuration without impairing the function that the target is movable relative to the magnet unit. Further, when the inside of the vacuum chamber is evacuated, it is only necessary to evacuate only the portion surrounded by the cap body, and therefore it is not necessary to use a large vacuum pump for evacuating the vacuum chamber. In addition, since the driving means for driving the target is installed in the atmosphere outside the vacuum chamber, it is not necessary to use an expensive vacuum device as the driving means.
- the direction in which the target reciprocates along the support plate is set.
- the longitudinal direction of the target perpendicular to the X-axis direction and the X-axis direction is defined as the Y-axis direction
- the position where the magnet unit and the target are concentric is the starting position. It is preferable to provide other driving means for relatively moving the magnet unit between the starting position and both folding positions, with the moved position as the folding position. According to this, local erosion of the target can be avoided, and the target can be eroded almost uniformly over the entire surface until the end of life, so that the usage efficiency of the target can be improved.
- the magnet unit in order to prevent the film formation conditions from changing excessively, the magnet unit is appropriately moved between the starting position and the folding position at a time other than the time when the target is sputtered to form a film. It is desirable that the film forming process be performed while being fixed to the position of the magnet unit.
- the supply pipe and the discharge pipe are respectively provided at both ends of each backing plate in a direction perpendicular to the reciprocating direction.
- the other of the pipe and the discharge pipe is surrounded by a single cap body, and both targets are reciprocally moved in conjunction with each other by a drive unit. According to this, the volume in the cap body to be evacuated with the evacuation of the vacuum chamber can be reduced as much as possible, which is advantageous.
- the target is powered. It is possible to realize the structure to be thrown in as simple and easy to maintain.
- FIG. 4 The perspective view explaining the film-forming unit of 1st Embodiment of this invention.
- wire of FIG. 1 which has a target in a starting position.
- wire of FIG. FIG. 4 is a cross-sectional perspective view taken along line IV-IV in FIG. 3.
- Sectional drawing corresponding to FIG. 2 shown in the state which moved the target to the folding position.
- a first embodiment of a film forming unit for a magnetron sputtering apparatus of the present invention will be described with reference to the drawings.
- the film forming unit FU 1 shown in FIG. 1 is attached to and detached from the opening of the vacuum chamber (not shown), and terms indicating directions such as “up” and “down” are based on this attitude.
- the direction in which the target reciprocates with a fixed stroke with respect to the magnet unit will be described as the X-axis direction
- the longitudinal direction of the target perpendicular to the X-axis direction will be described as the Y-axis direction.
- FU 1 is a film forming unit for a magnetron sputtering apparatus according to an embodiment of the present invention, and can be closely attached to a peripheral portion of a lower surface opening of a vacuum chamber (not shown) via a vacuum seal 11.
- a long and rectangular support plate 1 is provided in the X-axis direction.
- two targets 2a and 2b having the same shape and having a rectangular outline extending in the Y-axis direction are juxtaposed in the X-axis direction.
- the targets 2a and 2b are appropriately selected according to the composition of the thin film to be formed on the substrate (not shown) disposed in the vacuum chamber. As shown in FIG.
- backing plates 3a and 3b having the same shape and a rectangular outline larger than the targets 2a and 2b are joined to the lower surfaces of the targets 2a and 2b, respectively.
- a refrigerant passage 31 is formed inside the backing plates 3a and 3b. By supplying a refrigerant such as cooling water to the refrigerant passage 31, the targets 2a and 2b can be cooled during sputtering. And each target 2a, 2b is stored in the target case 4 in the state joined to backing plate 3a, 3b.
- the target case 4 is composed of a box body 42 that is partitioned into two chambers by a partition wall 41 extending in the Y-axis direction, and a cover plate 43 that is attached on the box body 42.
- a spacer 44 made of an insulating material is provided inside the bottom surface of the box body 42, and the backing plates 3 a and 3 b are fixedly disposed on the spacer 44.
- the cover plate 43 has two first openings that surround the outer peripheries of the targets 2a and 2b with a gap when the targets 2a and 2b are stored in the box 42 while being bonded to the backing plates 3a and 3b. 43a and 43b are established.
- two second openings 42a and 42b that are long in the X-axis direction are opened.
- the lengths of the second openings 42a and 42b in the X-axis direction are determined according to the reciprocating stroke of the targets 2a and 2b.
- sliders 45 are respectively provided on the lower surfaces of the box bodies 42 located at both ends in the Y-axis direction, and each slider 45 is a pair that is long on the support plate 1 in the X-axis direction.
- the rail member 12 is slidably engaged.
- the target case 4 is held on the support plate 1, and the target case 4 and thus the targets 2a and 2b are interlocked with each other along a pair of rail members 12 by a driving means described later with a constant stroke in the X-axis direction. Reciprocates.
- magnet units 5a and 5b having the same configuration are positioned below the targets 2a and 2b, respectively, and protrude into the box 42 through the second openings 42a and 42b. Each is fixedly arranged via Each of the magnet units 5a and 5b includes a yoke 52 that is long in the Y-axis direction and has a rectangular outline, and a central magnet 53 and a peripheral magnet 54 that is disposed so as to surround the central magnet 53 on the upper surface of the yoke 52. And are provided.
- the central magnet 53 and the peripheral magnet 54 neodymium magnets having the same magnetization are used.
- a bar-shaped one having a substantially square cross section formed integrally can be used. Thereby, each of the closed-loop leakage magnetic fields balanced on the targets 2a and 2b can be applied.
- refrigerant supply pipes 32a and 33a and discharge pipes 32b and 33b communicating with the refrigerant passage 31 protrude downward from both ends of the backing plates 3a and 3b in the Y-axis direction.
- the supply pipes 32 a and 33 a and the discharge pipes 32 b and 33 b are made of metal and have the same form, and the first part 321 extending downward from the refrigerant passage 31 and the first part 321.
- the second portion 322 extends in the X-axis direction from the lower end.
- the second portion 322 of the discharge pipe 33b of the other backing plate 3b are provided so as to extend in the opposite directions from the first portion 321 on the same line in the X-axis direction.
- the attachment flange 323 is formed in the edge part of the 2nd part 322, respectively, the coupling 6 protrudes from the outer surface of the attachment flange 323, and piping from the equipment side outside a figure can be connected now.
- the joint 6 is also connected with an output cable K from a sputtering power source Ps appropriately selected from a DC power source, a high-frequency power source and the like according to the types of the targets 2a and 2b (see FIG. 2), and supply pipes 32a and 33a.
- a sputtering power source Ps appropriately selected from a DC power source, a high-frequency power source and the like according to the types of the targets 2a and 2b (see FIG. 2), and supply pipes 32a and 33a.
- DC power or high frequency power having a negative potential can be applied from the discharge pipes 32b and 33b to the targets 2a and 2b through the backing plates 3a and 3b.
- the joint 6 is a component part of the supply pipes 32a and 33a and the discharge pipes 32b and 33b.
- the support plate 1 is provided with two slit holes 13 that are long in the X-axis direction through which the supply pipes 32 a and 33 a and the discharge pipes 32 b and 33 b are inserted, and the target case 4 is formed on the support plate 1.
- the first portions 321 of the supply pipes 32a, 33a and the discharge pipes 32b, 33b extending from the backing plates 3a, 3b are inserted through the slit holes 13 so as to protrude downward.
- the length of the slit hole 13 in the X-axis direction is fixed according to the reciprocating stroke of the targets 2a and 2b.
- the lower surface of the support plate 1 surrounds the first portion 321 of the supply pipes 32a and 33a and the discharge pipes 32b and 33b which are inserted through the slit hole 13 and protrude downward, including the slit hole 13.
- Two cap bodies 71 are provided to be kept airtight. Each cap body 71 includes a supply pipe 32a of one backing plate 3a, a supply pipe 33a of another backing plate 3b, and a discharge pipe 32b of one backing plate 3a and a discharge pipe 33b of another backing plate 3b. I try to enclose each one.
- each cap body 71 is provided with a through hole 71 a through which the second portion 322 passes, and the second portion 322 protruding from the cap body 71 is covered between the cap body 71 and each mounting flange 323.
- the bellows pipes 72 having the same form that are kept airtight are respectively extrapolated.
- the through hole 71a of the cap body 71 is hermetically held by sealing means (not shown) provided on one flange 72a of the bellows pipe 72, and the other flange 72b of the bellows pipe 72 is connected to the inner surface of the mounting flange 323. Are joined via a sealing means 72c.
- a driving means 8 is provided on the lower surface of the support plate 1.
- the driving means 8 includes a motor 81 attached to the center of the lower surface of the support plate 1, a feed screw 82 connected to the motor 81 as a drive unit, and a drive screwed to the feed screw 82.
- the operation rod 83 is provided as a part, and both end portions of the operation rod 83 are connected to mounting flanges 323 of the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b, respectively.
- the targets 2a and 2b have one side in the X-axis direction (that is, the position close to the right side with respect to the magnet units 5a and 5b shown in FIG. 2) as the starting point of the reciprocating motion.
- the operation pipe 83 moves the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b to move toward the other side in the X-axis direction (left side in FIG. 2).
- the magnet case 4 moves, and the targets 2a and 2b reach the folding point on the other side in the X-axis direction (that is, the position closer to the left side with respect to the magnet units 5a and 5b shown in FIG. 5).
- the expanding and contracting bellows pipe 72 that is, when the support plate 1 is attached to the vacuum chamber and film formation is performed by sputtering in a vacuum, the magnet case is maintained while maintaining the vacuum atmosphere in the vacuum chamber. 4 moves.
- the feed screw 82 is reversed by the motor 81, and the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b are interlocked with each other by the operating rod 83.
- the magnet case 4 moves and the targets 2a and 2b return to their starting points.
- the driving means 8 is not limited to the one having the above-described configuration, and the form thereof is not limited as long as the targets 2a and 2b can be moved synchronously.
- a cover body 9 is provided on the support plate 1 to surround the targets 2a and 2b with a space above them.
- the cover body 9 has a box shape with an open bottom surface, and is installed in a state where the lower end thereof is in contact with the support plate 1 over the entire circumference.
- An isolating plate 91 is provided in the cover body 9 so as to isolate a space 94a in which one target 2a exists from a space 94b in which another target 2b exists.
- two openings 93a and 93b respectively facing the targets 2a and 2b are formed.
- the support plate 1 and the cover body 9 are mainly surrounded by the openings 93a and 93b.
- the spaces 94a and 94b (that is, there are reciprocating targets and plasma is formed) are evacuated.
- Two gas nozzles Gn1 and Gn2 are provided on the outer surfaces of the side wall portions 95a and 95b located in the X-axis direction of the cover body 9, respectively.
- Each gas nozzle Gn1, Gn2 has a length along the Y-axis direction of the targets 2a, 2b, and injection ports Gnh for injecting gas toward the side wall portion of the cover body 9 are arranged at predetermined intervals in the X-axis direction.
- the upper gas nozzle Gn1 is for introducing a rare gas for discharge
- the lower gas nozzle Gn2 is for introducing a reactive gas.
- Gas holes 96a and 96b are formed in the side wall portions 95a and 95b of the cover body 9 so as to face the injection ports Gnh of the gas nozzles Gn1 and Gn2, respectively.
- the diameter of each gas hole 96a, 96b is set to be equal to or greater than the diameter of the injection port Gnh.
- the mounting positions of the gas nozzles Gn1 and Gn2 with respect to the side wall portion of the cover body 9 and the diameter and number of the injection ports Gnh are appropriately selected in consideration of the volume of the vacuum chamber, the exhaust capacity of the vacuum pump, and the like.
- the gas holes 96a and 96b are formed in the side wall portions 95a and 95b of the cover body 9 so as to face the opening Gnh will be described, the present invention is not limited to this.
- a gas hole can also be comprised by the slit-shaped long hole facing the opening
- the exhaust conductance from the spaces 94a and 94b in the cover body 9 hardly changes.
- the reactive gas is introduced into the vacuum chamber through the gas hole 96 by the gas nozzle Gn2 when forming the film by reactive sputtering, the distribution of the reactive gas in the spaces 94a and 94b hardly changes, and as a result, A thin film can be formed by reactive sputtering with good film quality uniformity.
- the cover body 9 is in contact with the support plate 1, and the support plate 1 is usually attached to a grounded vacuum chamber.
- the cover body 9 itself becomes a ground potential, and when the targets 2a and 2b are powered on and sputtered, the upper wall portion 92 of the cover body 9 located at the periphery of the openings 93a and 93b serves as an anode. Can be discharged stably.
- the driving means 8 for driving the targets 2a and 2b is installed in the atmosphere outside the vacuum chamber, it is not necessary to use an expensive vacuum means as the driving means 8.
- the second portion 322 of the supply pipe 32a of the one backing plate 3a, the second portion 322 of the supply pipe 33a of the other backing plate 3b, and the discharge pipe 32b of the one backing plate 3a By adopting a configuration in which the second part 322 and the second part 322 of the discharge pipe 33b of the other backing plate 3b are positioned on the same line, and the bellows pipe 72 of the same form is extrapolated to each second part 322, Since the differential pressure between the atmospheric pressure and the vacuum pressure can be canceled when the targets 2a and 2b are reciprocated by the drive means 8, and the drive means 8 does not need to be responsible for the differential pressure, for example, the motor 81 of the drive means 8 is Since only a small rated torque is required and no force against the vacuum pressure is required, it is not necessary to give the operating rod 83 strong strength and the feed screw 82 is thin.
- the driving means 8 for example, the motor 81 fails for some reason, it simply returns to the position where the spring force of each bellows pipe 72 located on the same line is antagonized. High safety can be obtained without the need for structural or electrical damage prevention means for preventing the drive part from being damaged.
- this invention is not limited above.
- an example using two targets 2a and 2b has been described.
- the present invention can also be applied to a case where a single target is used, and the present invention can be applied to a case where three targets are used.
- the case where the targets 2a and 2b are stored in the magnet case 4 has been described as an example.
- the present invention is not limited to this, and the support plate is electrically insulated from the support plate. As long as it can be reciprocated with respect to the magnet unit, the form is not limited.
- the magnet units 5a and 5b are constituted by the central magnet 53 provided on the upper surface of the yoke 52 and the peripheral magnet 54 surrounding the central magnet 53 as in the above embodiment, a rare gas for discharge is introduced.
- a rare gas for discharge is introduced.
- plasma is generated along the racetrack, but the electron density in the plasma tends to increase locally at the corners of the racetrack.
- the magnet units 5a and 5b are fixedly arranged on the support plate 1 below the targets 2a and 2b, respectively, the X-axis direction of the targets 2a and 2b with respect to the magnet units 5a and 5b.
- the targets 2a and 2b are eroded almost uniformly in the X-axis direction by relative movement to the target, the targets 2a and 2b at the ends in the Y-axis direction of the targets 2a and 2b corresponding to the corners of the racetrack Is locally eroded. As a result, the targets 2a and 2b reach the end of life at an early stage, and the utilization efficiency of the targets 2a and 2b is poor.
- a drive shaft that penetrates the Y-axis direction long slit hole formed in the support plate 1 is connected to the back surface of the yoke 52, and the magnet unit 5a, via the drive shaft is driven by a drive source provided in the atmosphere.
- 5b is preferably configured to be relatively movable in the Y-axis direction with respect to the targets 2a and 2b.
- the drive source has a position where the magnet units 5a, 5b and the targets 2a, 2b are concentric as a starting position, and a position moved from the starting position by a predetermined stroke in the Y-axis direction is a folding position.
- the magnet units 5a and 5b are moved relative to each other between the starting position and the folding position.
- the drive system of the above-described embodiment in which the targets 2a and 2b as components in a vacuum are reciprocated by a motor 81 arranged in the atmosphere can be used.
- the relative movement of the targets 2a and 2b with respect to the magnet units 5a and 5b is not performed during sputtering of the targets 2a and 2b so that the film forming conditions do not change excessively.
- the stroke of the relative movement of the magnet units 5a and 5b with respect to the targets 2a and 2b and the staying time at the starting position or the turn-back position are, for example, the erosion area and the erosion speed when the targets 2a and 2b are sputtered at the starting position.
- the moving positions of the magnet units 5a and 5b are not limited to the above three points, and can be increased as appropriate according to the erosion state of the targets 2a and 2b.
- the magnet units 5a and 5b can be appropriately reciprocated at a predetermined speed between the folding positions during sputtering of the targets 2a and 2b.
- the first drive means 80a allows the targets 2a and 2b to reciprocate in the X-axis direction
- the second drive means 80b moves the magnet units 5a and 5b in the Y-axis direction.
- the sputtering apparatus for film formation unit FU 2 of the second embodiment was able to reciprocate described.
- the direction in which the targets 2a and 2b reciprocate with a fixed stroke with respect to the magnet units 5a and 5b is the X-axis direction
- the target longitudinal direction perpendicular to the X-axis direction Is the Y-axis direction, and the same reference numerals are used for the same members or elements as in the first embodiment, and the configuration different from the first embodiment will be mainly described.
- the film forming unit FU 2 for the magnetron sputtering apparatus includes the support plate 1 as in the first embodiment, and has a rectangular outline extending in the Y-axis direction on the support plate 1.
- Two targets 2 a and 2 b having the same form are juxtaposed in a state of being joined to the backing plates 3 a and 3 b, and stored in the target case 4.
- the first drive means 80a is adapted to reciprocate the target case 4 along the pair of rail members (not shown), and consequently the targets 2a and 2b, with a constant stroke in the X-axis direction.
- the first drive means 80a for reciprocating the targets 2a and 2b in the X-axis direction is a plate-like drive shaft 801 that is inserted into the first slit hole 101a that is long in the X-axis direction provided at the center of the support 1. Is provided. In this case, the length of the slit hole 101a in the X-axis direction is determined according to the stroke of reciprocation of the targets 2a and 2b, as in the first embodiment.
- the upper end portion of the drive shaft 801 is fitted to a cylindrical body 41 a erected at a predetermined position on the lower surface of the partition wall 41 of the magnet case 4.
- a screw hole (not shown) in the plate thickness direction is formed at the lower end portion of the drive shaft 801 protruding downward from the support 1, and a feed screw 802 extending in the X-axis direction is screwed into the screw hole.
- the feed screw 802 is provided on the lower surface of the support plate 1 and includes a slit hole 101a.
- the cap body 701 surrounds the lower end portion of the drive shaft 801 protruding downward from the support body 1 and holds the inside thereof in an airtight manner. Are pivotally supported via a pair of bearings 803a and 803b.
- a motor 805 attached to the lower surface of the support 1 via a magnetic fluid seal 804 is connected to one end of the feed screw 802 that protrudes outward from the cap body 701, whereby the magnet case 4 and eventually the target 2a, 2b can reciprocate in the X-axis direction.
- the drive shaft 801 since the drive shaft 801 is directly connected to the magnet case 4, parts such as the operation rod 83 of the first embodiment can be omitted, so that the drive input path can be simplified.
- the rigidity can be improved.
- the drive shaft 801 causes the magnet case 4 to be centered (near the center of inertia moment).
- the cap body 702 provided on the lower surface of the support plate 1 is inserted through the slit hole 13 including the slit hole 13 in accordance with the change in the configuration of the driving unit 80a as described above. It has changed so that the 1st part 321 of the supply pipes 32a and 33a and the discharge pipes 32b and 33b which protrude below may be enclosed, respectively (refer FIG. 7).
- the second driving means 80b for reciprocating the magnet units 5a and 5b in the Y-axis direction is positioned in the vicinity of the first slit hole 101a and is provided in the support 1 so as to be long in the Y-axis direction.
- a plate-like drive shaft 810 is provided.
- the length of the slit hole 101b in the Y-axis direction is fixed according to the reciprocating stroke of the magnet units 5a and 5b.
- the upper end portion of the drive shaft 810 is fitted into a fitting hole 812 formed in a drive plate 811 provided to bridge between the yokes 52 of the magnet units 5a and 5b. In this case, as shown in FIG.
- sliders 501 are respectively provided on the lower surfaces of the yokes 52 of the magnet units 5 a and 5 b, and each slider 501 is long in the Y-axis direction installed on the support plate 1.
- the rail member 502 is slidably engaged.
- a screw hole (not shown) in the plate thickness direction is formed at the lower end of the drive shaft 810 protruding downward from the support 1, and a feed screw 813 extending in the Y-axis direction is screwed into the screw hole.
- the feed screw 813 is provided on the lower surface of the support plate 1 and includes a slit hole 101b.
- the cap body 703 surrounds the lower end portion of the drive shaft 810 protruding downward from the support body 1 and hermetically holds the inside thereof. Are supported by a pair of bearings 814a and 814b.
- One end of a feed screw 813 protruding from the cap body 703 is connected to another motor 816 attached to the lower surface of the support 1 via a magnetic fluid seal 815, so that the magnet units 5a and 5b are moved in the Y-axis direction. It will reciprocate.
- FU 1 , FU 2 ... Film forming unit for sputtering apparatus 1 ... support plate, 13 ... slit hole, 2a, 2b ... target, 3a, 3b ... backing plate, 31 ... refrigerant passage, 32a, 33a ... supply pipe, 33a, 33b ... discharge pipe, 5a, 5b ... magnet unit, 71 ... cap body, 72 ... bellows pipe, 8, 80a, 80b ... drive means, 82 ... feed screw (drive part), 83 ... operation rod (drive part), 9 ... Cover body, 92 ... Opening, Ps ... Sputtering power supply, K ... Output cable.
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Abstract
Description
Claims (4)
- 真空チャンバの開口に着脱自在な支持板を備え、支持板の一方の面側を上として、この支持板上に、下面にバッキングプレートが接合されたターゲットと、バッキングプレートと支持板との間に固定配置されてターゲット上に漏洩磁場を作用させるマグネットユニットとを有するスパッタリング装置用成膜ユニットであって、
スパッタ電源よりターゲットに電力投入してターゲットをスパッタリングする間、マグネットユニットに対してターゲットを支持板に沿って往復動する駆動手段を更に備えるものにおいて、
バッキングプレートに、その内部に形成された冷媒通路に通じる冷媒の供給管と排出管とが突設され、供給管と排出管とが夫々挿通する、ターゲットの往復動方向に長手のスリット孔が支持板に開設され、支持板の下面に、スリット孔を含む、供給管と排出管のスリット孔から下方に突出した部分を気密状態に夫々囲うキャップ体が設けられ、キャップ体から往復動方向に突出する供給管と排出管との部分にベローズ管が夫々外挿され、駆動手段の駆動部が供給管及び排出管の少なくとも一方に連結されることを特徴とするスパッタリング装置用成膜ユニット。 - 請求項1記載のスパッタリング装置用成膜ユニットであって、各ターゲットと支持板との間にターゲットのスパッタ面側に漏洩磁場を夫々作用させるマグネットユニットが配置されるものにおいて、
前記ターゲットが前記支持板に沿って往復動する方向をX軸方向、X軸方向に対して直交するターゲットの長手方向をY軸方向とし、マグネットユニットとターゲットとが同心になる位置を起点位置、この起点位置からY軸方向に夫々所定のストロークで移動させた位置を折返位置とし、起点位置と両折返位置との間でマグネットユニットを相対移動させる他の駆動手段を備えることを特徴とするスパッタリング装置用成膜ユニット。 - 請求項1または請求項2記載のスパッタリング装置用成膜ユニットであって、同一平面内に並設される矩形の輪郭を持つ2枚のターゲットを備えるものにおいて、
供給管と排出管とが往復動方向に対して直交する方向で各バッキングプレートの両端部に夫々設けられ、
一のターゲットの供給管と排出管との一方と他のターゲットの供給管と排出管との一方と、及び、一のターゲットの供給管と排出管との他方と他のターゲットの供給管と排出管との他方とが、単一のキャップ体で夫々囲われ、駆動部により両ターゲットが連動して往復動するように構成されることを特徴とするスパッタリング装置用成膜ユニット。 - 前記供給管と前記排出管との少なくとも一方にスパッタ電源からの出力ケーブルが接続され、バッキングプレートを介してターゲットに電力投入するようにしたことを特徴とする請求項1~請求項3のいずれか1項に記載のスパッタリング装置成膜ユニット。
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KR1020197002979A KR102102812B1 (ko) | 2016-06-29 | 2017-06-21 | 스퍼터링 장치용 성막 유닛 |
CN201780041260.5A CN109415802B (zh) | 2016-06-29 | 2017-06-21 | 溅射装置用成膜单元 |
JP2017547005A JP6271822B1 (ja) | 2016-06-29 | 2017-06-21 | スパッタリング装置用成膜ユニット |
US16/311,844 US10770275B2 (en) | 2016-06-29 | 2017-06-21 | Film forming unit for sputtering apparatus |
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JP5903217B2 (ja) * | 2011-03-24 | 2016-04-13 | 株式会社アルバック | マグネトロンスパッタ電極及びスパッタリング装置 |
KR20120122965A (ko) * | 2011-04-28 | 2012-11-07 | 닛토덴코 가부시키가이샤 | 진공성막 방법 및 이 방법에 따라 얻을 수 있는 적층체 |
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JPH01111870A (ja) * | 1987-10-23 | 1989-04-28 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
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