JPS5259571A - Substrate for face down bonding - Google Patents

Substrate for face down bonding

Info

Publication number
JPS5259571A
JPS5259571A JP50134667A JP13466775A JPS5259571A JP S5259571 A JPS5259571 A JP S5259571A JP 50134667 A JP50134667 A JP 50134667A JP 13466775 A JP13466775 A JP 13466775A JP S5259571 A JPS5259571 A JP S5259571A
Authority
JP
Japan
Prior art keywords
bonding
substrate
face down
down bonding
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50134667A
Other languages
English (en)
Inventor
Toshio Takeuchi
Tamao Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Oki Electric Industry Co Ltd
Shingijutsu Kaihatsu Jigyodan
Original Assignee
Oki Electric Industry Co Ltd
Research Development Corp of Japan
Shingijutsu Kaihatsu Jigyodan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd, Research Development Corp of Japan, Shingijutsu Kaihatsu Jigyodan filed Critical Oki Electric Industry Co Ltd
Priority to JP50134667A priority Critical patent/JPS5259571A/ja
Publication of JPS5259571A publication Critical patent/JPS5259571A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP50134667A 1975-11-11 1975-11-11 Substrate for face down bonding Pending JPS5259571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50134667A JPS5259571A (en) 1975-11-11 1975-11-11 Substrate for face down bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50134667A JPS5259571A (en) 1975-11-11 1975-11-11 Substrate for face down bonding

Publications (1)

Publication Number Publication Date
JPS5259571A true JPS5259571A (en) 1977-05-17

Family

ID=15133732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50134667A Pending JPS5259571A (en) 1975-11-11 1975-11-11 Substrate for face down bonding

Country Status (1)

Country Link
JP (1) JPS5259571A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128147U (ja) * 1981-02-03 1982-08-10
JPS5999794A (ja) * 1982-11-29 1984-06-08 株式会社デンソー 厚膜回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128147U (ja) * 1981-02-03 1982-08-10
JPS5999794A (ja) * 1982-11-29 1984-06-08 株式会社デンソー 厚膜回路装置

Similar Documents

Publication Publication Date Title
JPS5259571A (en) Substrate for face down bonding
JPS5255881A (en) Semiconductor integrated circuit
JPS5272586A (en) Production of semiconductor device
JPS5272571A (en) Production of semiconductor device
JPS5323564A (en) Bump type semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5261960A (en) Production of semiconductor device
JPS5263672A (en) Production of semiconductor device
JPS5356969A (en) Production of tape for tape carrier
JPS5283166A (en) Semiconductor device and its production
JPS5219968A (en) Semiconductor ic manufacturig process
JPS5318960A (en) Bonding method
JPS5249783A (en) Semiconductor device and process for production of same
JPS5346279A (en) Production of semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5362481A (en) Production of semiconductor device
JPS5211772A (en) Semiconductor device
JPS5344172A (en) Semiconductor integrated circuit
JPS527680A (en) Ic chip mounted structure
JPS5210676A (en) Semiconductor device
JPS5332674A (en) Sealing structure of semiconductor device and its production
JPS51112266A (en) Semiconductor device production method
JPS5335382A (en) Securing method of flip chips
JPS5322366A (en) Electronic part
JPS5258369A (en) Production of semiconductor device