JPS5255863A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5255863A
JPS5255863A JP50131489A JP13148975A JPS5255863A JP S5255863 A JPS5255863 A JP S5255863A JP 50131489 A JP50131489 A JP 50131489A JP 13148975 A JP13148975 A JP 13148975A JP S5255863 A JPS5255863 A JP S5255863A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
protective film
chip
carcking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50131489A
Other languages
Japanese (ja)
Inventor
Takashi Yokoyama
Yasuo Miyadera
Yasuhide Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50131489A priority Critical patent/JPS5255863A/en
Publication of JPS5255863A publication Critical patent/JPS5255863A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a can-sealed type semiconductor device wherein leak current under high temperature and occurance of carcking of protective film are reduced, by forming a protective film made of polymer on the surface of a semiconductor element chip, then can-sealing the chip in an inert atmosphere under reduced pressure.
COPYRIGHT: (C)1977,JPO&Japio
JP50131489A 1975-11-04 1975-11-04 Production of semiconductor device Pending JPS5255863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50131489A JPS5255863A (en) 1975-11-04 1975-11-04 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50131489A JPS5255863A (en) 1975-11-04 1975-11-04 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5255863A true JPS5255863A (en) 1977-05-07

Family

ID=15059177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50131489A Pending JPS5255863A (en) 1975-11-04 1975-11-04 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5255863A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683958A (en) * 1979-12-12 1981-07-08 Fujitsu Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683958A (en) * 1979-12-12 1981-07-08 Fujitsu Ltd Semiconductor device

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