JPS5210068A - Method for dividing semiconductor substrate - Google Patents

Method for dividing semiconductor substrate

Info

Publication number
JPS5210068A
JPS5210068A JP8582675A JP8582675A JPS5210068A JP S5210068 A JPS5210068 A JP S5210068A JP 8582675 A JP8582675 A JP 8582675A JP 8582675 A JP8582675 A JP 8582675A JP S5210068 A JPS5210068 A JP S5210068A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
dividing semiconductor
dividing
substrate
avoid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8582675A
Other languages
Japanese (ja)
Other versions
JPS5342660B2 (en
Inventor
Masanori Konuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP8582675A priority Critical patent/JPS5210068A/en
Publication of JPS5210068A publication Critical patent/JPS5210068A/en
Publication of JPS5342660B2 publication Critical patent/JPS5342660B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To avoid influence by hardness of a base on which a substrate is placed at dividing semiconductor substrate and to avoid disorder in line up of a semiconductor substrate after dividing it.
COPYRIGHT: (C)1977,JPO&Japio
JP8582675A 1975-07-15 1975-07-15 Method for dividing semiconductor substrate Granted JPS5210068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8582675A JPS5210068A (en) 1975-07-15 1975-07-15 Method for dividing semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8582675A JPS5210068A (en) 1975-07-15 1975-07-15 Method for dividing semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5210068A true JPS5210068A (en) 1977-01-26
JPS5342660B2 JPS5342660B2 (en) 1978-11-14

Family

ID=13869645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8582675A Granted JPS5210068A (en) 1975-07-15 1975-07-15 Method for dividing semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5210068A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167005A (en) * 1987-12-22 1989-06-30 Yamagata Gravure:Kk Method and apparatus for packing goods after arranging the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167005A (en) * 1987-12-22 1989-06-30 Yamagata Gravure:Kk Method and apparatus for packing goods after arranging the same

Also Published As

Publication number Publication date
JPS5342660B2 (en) 1978-11-14

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