JPS51292B1 - - Google Patents

Info

Publication number
JPS51292B1
JPS51292B1 JP43064967A JP6496768A JPS51292B1 JP S51292 B1 JPS51292 B1 JP S51292B1 JP 43064967 A JP43064967 A JP 43064967A JP 6496768 A JP6496768 A JP 6496768A JP S51292 B1 JPS51292 B1 JP S51292B1
Authority
JP
Japan
Prior art keywords
chips
plate
soldered
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP43064967A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP43064967A priority Critical patent/JPS51292B1/ja
Priority to GB44372/69A priority patent/GB1276682A/en
Priority to FR6930572A priority patent/FR2017780A1/fr
Priority to DE19691945899 priority patent/DE1945899B2/de
Publication of JPS51292B1 publication Critical patent/JPS51292B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W40/77—
    • H10W70/682—
    • H10W72/07236—
    • H10W72/07353—
    • H10W72/252—
    • H10W72/334—
    • H10W72/5363—
    • H10W72/877—
    • H10W72/879—
    • H10W72/884—
    • H10W72/931—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP43064967A 1968-09-11 1968-09-11 Pending JPS51292B1 (cg-RX-API-DMAC10.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (cg-RX-API-DMAC10.html) 1968-09-11 1968-09-11
GB44372/69A GB1276682A (en) 1968-09-11 1969-09-08 Semiconductor device and its manufacturing method
FR6930572A FR2017780A1 (cg-RX-API-DMAC10.html) 1968-09-11 1969-09-09
DE19691945899 DE1945899B2 (de) 1968-09-11 1969-09-10 Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (cg-RX-API-DMAC10.html) 1968-09-11 1968-09-11

Publications (1)

Publication Number Publication Date
JPS51292B1 true JPS51292B1 (cg-RX-API-DMAC10.html) 1976-01-07

Family

ID=13273309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP43064967A Pending JPS51292B1 (cg-RX-API-DMAC10.html) 1968-09-11 1968-09-11

Country Status (4)

Country Link
JP (1) JPS51292B1 (cg-RX-API-DMAC10.html)
DE (1) DE1945899B2 (cg-RX-API-DMAC10.html)
FR (1) FR2017780A1 (cg-RX-API-DMAC10.html)
GB (1) GB1276682A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US20080128895A1 (en) * 2006-12-05 2008-06-05 Oman Todd P Wafer applied thermal-mechanical interface
WO2016153085A1 (ko) * 2015-03-20 2016-09-29 한온시스템 주식회사 전동압축기 인버터 냉각장치 및 이를 구비한 인버터 조립체
US10403594B2 (en) * 2018-01-22 2019-09-03 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same
DE112019007709B4 (de) * 2019-09-13 2025-08-28 Denso Corporation Halbleitervorrichtung

Also Published As

Publication number Publication date
FR2017780A1 (cg-RX-API-DMAC10.html) 1970-05-22
DE1945899B2 (de) 1972-04-20
DE1945899A1 (de) 1970-03-26
GB1276682A (en) 1972-06-07

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