JPS6151427B2 - - Google Patents
Info
- Publication number
- JPS6151427B2 JPS6151427B2 JP56153968A JP15396881A JPS6151427B2 JP S6151427 B2 JPS6151427 B2 JP S6151427B2 JP 56153968 A JP56153968 A JP 56153968A JP 15396881 A JP15396881 A JP 15396881A JP S6151427 B2 JPS6151427 B2 JP S6151427B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- multilayer
- semiconductor integrated
- ceramic substrate
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/251—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56153968A JPS5856445A (ja) | 1981-09-30 | 1981-09-30 | 多層セラミツクパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56153968A JPS5856445A (ja) | 1981-09-30 | 1981-09-30 | 多層セラミツクパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5856445A JPS5856445A (ja) | 1983-04-04 |
| JPS6151427B2 true JPS6151427B2 (cg-RX-API-DMAC10.html) | 1986-11-08 |
Family
ID=15574001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56153968A Granted JPS5856445A (ja) | 1981-09-30 | 1981-09-30 | 多層セラミツクパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856445A (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0658939B2 (ja) * | 1984-07-20 | 1994-08-03 | 株式会社日立製作所 | 半導体装置 |
| FR2570383B1 (fr) * | 1984-09-20 | 1988-03-18 | Nec Corp | Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee |
| GB8509439D0 (en) * | 1985-04-12 | 1985-05-15 | Artus R G C | Heat sink |
| US5184211A (en) * | 1988-03-01 | 1993-02-02 | Digital Equipment Corporation | Apparatus for packaging and cooling integrated circuit chips |
| US5285559A (en) * | 1992-09-10 | 1994-02-15 | Sundstrand Corporation | Method and apparatus for isolating electronic boards from shock and thermal environments |
-
1981
- 1981-09-30 JP JP56153968A patent/JPS5856445A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5856445A (ja) | 1983-04-04 |
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