JPS5856445A - 多層セラミツクパツケ−ジ - Google Patents

多層セラミツクパツケ−ジ

Info

Publication number
JPS5856445A
JPS5856445A JP56153968A JP15396881A JPS5856445A JP S5856445 A JPS5856445 A JP S5856445A JP 56153968 A JP56153968 A JP 56153968A JP 15396881 A JP15396881 A JP 15396881A JP S5856445 A JPS5856445 A JP S5856445A
Authority
JP
Japan
Prior art keywords
resin
multilayer wiring
integrated circuit
ceramic substrate
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56153968A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6151427B2 (cg-RX-API-DMAC10.html
Inventor
Mitsuru Nitta
満 新田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56153968A priority Critical patent/JPS5856445A/ja
Publication of JPS5856445A publication Critical patent/JPS5856445A/ja
Publication of JPS6151427B2 publication Critical patent/JPS6151427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/251—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56153968A 1981-09-30 1981-09-30 多層セラミツクパツケ−ジ Granted JPS5856445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56153968A JPS5856445A (ja) 1981-09-30 1981-09-30 多層セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56153968A JPS5856445A (ja) 1981-09-30 1981-09-30 多層セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5856445A true JPS5856445A (ja) 1983-04-04
JPS6151427B2 JPS6151427B2 (cg-RX-API-DMAC10.html) 1986-11-08

Family

ID=15574001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56153968A Granted JPS5856445A (ja) 1981-09-30 1981-09-30 多層セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5856445A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6129158A (ja) * 1984-07-20 1986-02-10 Hitachi Ltd 半導体装置
FR2570383A1 (fr) * 1984-09-20 1986-03-21 Nec Corp Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee
JPS61237457A (ja) * 1985-04-12 1986-10-22 レイモンド　ジ−ン　クリフオ−ド　ア−タス 吸熱器
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US5285559A (en) * 1992-09-10 1994-02-15 Sundstrand Corporation Method and apparatus for isolating electronic boards from shock and thermal environments

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6129158A (ja) * 1984-07-20 1986-02-10 Hitachi Ltd 半導体装置
FR2570383A1 (fr) * 1984-09-20 1986-03-21 Nec Corp Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee
JPS61237457A (ja) * 1985-04-12 1986-10-22 レイモンド　ジ−ン　クリフオ−ド　ア−タス 吸熱器
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US5285559A (en) * 1992-09-10 1994-02-15 Sundstrand Corporation Method and apparatus for isolating electronic boards from shock and thermal environments

Also Published As

Publication number Publication date
JPS6151427B2 (cg-RX-API-DMAC10.html) 1986-11-08

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