JPH0573061B2 - - Google Patents

Info

Publication number
JPH0573061B2
JPH0573061B2 JP60131717A JP13171785A JPH0573061B2 JP H0573061 B2 JPH0573061 B2 JP H0573061B2 JP 60131717 A JP60131717 A JP 60131717A JP 13171785 A JP13171785 A JP 13171785A JP H0573061 B2 JPH0573061 B2 JP H0573061B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor
holes
thermally conductive
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60131717A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61290743A (ja
Inventor
Keizo Kawamura
Takahiro Ooguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60131717A priority Critical patent/JPS61290743A/ja
Publication of JPS61290743A publication Critical patent/JPS61290743A/ja
Publication of JPH0573061B2 publication Critical patent/JPH0573061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/774—
    • H10W40/77—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60131717A 1985-06-19 1985-06-19 半導体デバイスの冷却装置 Granted JPS61290743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60131717A JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60131717A JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Publications (2)

Publication Number Publication Date
JPS61290743A JPS61290743A (ja) 1986-12-20
JPH0573061B2 true JPH0573061B2 (cg-RX-API-DMAC10.html) 1993-10-13

Family

ID=15064552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60131717A Granted JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Country Status (1)

Country Link
JP (1) JPS61290743A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010142333A1 (en) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Cooling arrangement and method for assembling the cooling arrangement
US8957316B2 (en) 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
DE102011005669A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Wärmeleitfolie für die Entwärmung und Fixierung elektronischer Bauelemente
JP7472224B1 (ja) * 2022-10-05 2024-04-22 レノボ・シンガポール・プライベート・リミテッド 放熱構造、電子機器、および伝熱構造体

Also Published As

Publication number Publication date
JPS61290743A (ja) 1986-12-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term