JPS51292B1 - - Google Patents

Info

Publication number
JPS51292B1
JPS51292B1 JP43064967A JP6496768A JPS51292B1 JP S51292 B1 JPS51292 B1 JP S51292B1 JP 43064967 A JP43064967 A JP 43064967A JP 6496768 A JP6496768 A JP 6496768A JP S51292 B1 JPS51292 B1 JP S51292B1
Authority
JP
Japan
Prior art keywords
chips
plate
soldered
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP43064967A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP43064967A priority Critical patent/JPS51292B1/ja
Priority to GB44372/69A priority patent/GB1276682A/en
Priority to FR6930572A priority patent/FR2017780A1/fr
Priority to DE19691945899 priority patent/DE1945899B2/en
Publication of JPS51292B1 publication Critical patent/JPS51292B1/ja
Pending legal-status Critical Current

Links

Classifications

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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1276682 Semi-conductor devices HITACHI Ltd 8 Sept 1969 [11 Sept 1968] 44372/69 Heading H1K. Cooling of a planar semi-conductor device chip face bonded to a conductive pattern on an insulating or insulation-coated substrate is facilitated by fixing a plate of larger superficial area than the chip to the exposed face of the chip via an intermediate member having a thermal conductivity superior to that of air. In the example illustrated in Fig. 1 the plate 3 is spaced from the ceramic substrate 4 by ceramic frame 2 soldered between it and the recessed base 1 to which the substrate is soldered. Typically the chips each include a transistor or a combination thereof with diodes, resistors, and capacitors and further film resistors or capacitors may be disposed on the substrate. The intermediate members are copper balls (or discs, cores, or hemispheres) 7 soldered to individual chips and subsequently soldered to the cooling plate, and the face bonding may involve use of ultrasonic welding, solder balls pedestals and/or beam leads. Alternatively the chips at the time of ball bonding are parts of a single wafer. In another arrangement a single intermediate member is bonded to a vapour deposited layer on the wafer and later subdivided with it. Flow of solder over the chips is limited by a surface layer of silica or silicon nitride. In modified forms plate 3 is outwardly dished or a separate dished member used which is soldered to the balls and attached to the plate by an elastic material such as silicone rubber or foamed resin filled with thermally conductive powders such as beryllia or alumina. Heat dissipation can be further enhanced by filling the casing with silicon oil. Where a separate dished member is used thermal stress is relieved by leaving it floating relative to plate 3 or attaching it to frame 2 via a sinuous flexible diaphragm. Otherwise the intermediate members may be of soft metal, sponge metal or the aforesaid filled elastomers or of sinuous flexible form. Flexible beam leads on the chips also help to absorb stress. As an alternative to solder a pressure contact may be used between the intermediate members and the chips or cooling plate with an intervening layer of tin, lead or silicon oil. Suitable materials for plate 3 are ceramics such as beryllia or metals. In the latter case a metallized silica or silicon nitride layer may be formed on the chips to afford electrical insulation. Techniques for face bonding the chips to the substrate are described with reference to Figs. 3 and 4 (not shown). External connections 10 may form strip line feeders with plate 3 earthed.
JP43064967A 1968-09-11 1968-09-11 Pending JPS51292B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (en) 1968-09-11 1968-09-11
GB44372/69A GB1276682A (en) 1968-09-11 1969-09-08 Semiconductor device and its manufacturing method
FR6930572A FR2017780A1 (en) 1968-09-11 1969-09-09
DE19691945899 DE1945899B2 (en) 1968-09-11 1969-09-10 Semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (en) 1968-09-11 1968-09-11

Publications (1)

Publication Number Publication Date
JPS51292B1 true JPS51292B1 (en) 1976-01-07

Family

ID=13273309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP43064967A Pending JPS51292B1 (en) 1968-09-11 1968-09-11

Country Status (4)

Country Link
JP (1) JPS51292B1 (en)
DE (1) DE1945899B2 (en)
FR (1) FR2017780A1 (en)
GB (1) GB1276682A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3521572A1 (en) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim PERFORMANCE SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US20080128895A1 (en) * 2006-12-05 2008-06-05 Oman Todd P Wafer applied thermal-mechanical interface
CN108995505B (en) * 2015-03-20 2022-04-12 翰昂汽车零部件有限公司 Electric compressor converter cooling device and converter assembly provided with same
US10403594B2 (en) * 2018-01-22 2019-09-03 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same

Also Published As

Publication number Publication date
DE1945899B2 (en) 1972-04-20
GB1276682A (en) 1972-06-07
FR2017780A1 (en) 1970-05-22
DE1945899A1 (en) 1970-03-26

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