JPS51126764A - Resin sealed semiconductor unit manufacturing process - Google Patents

Resin sealed semiconductor unit manufacturing process

Info

Publication number
JPS51126764A
JPS51126764A JP5044875A JP5044875A JPS51126764A JP S51126764 A JPS51126764 A JP S51126764A JP 5044875 A JP5044875 A JP 5044875A JP 5044875 A JP5044875 A JP 5044875A JP S51126764 A JPS51126764 A JP S51126764A
Authority
JP
Japan
Prior art keywords
semiconductor unit
sealed semiconductor
manufacturing process
resin sealed
unit manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5044875A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5314916B2 (enrdf_load_html_response
Inventor
Hiroshi Moriguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5044875A priority Critical patent/JPS51126764A/ja
Publication of JPS51126764A publication Critical patent/JPS51126764A/ja
Publication of JPS5314916B2 publication Critical patent/JPS5314916B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP5044875A 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process Granted JPS51126764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044875A JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044875A JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Publications (2)

Publication Number Publication Date
JPS51126764A true JPS51126764A (en) 1976-11-05
JPS5314916B2 JPS5314916B2 (enrdf_load_html_response) 1978-05-20

Family

ID=12859134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044875A Granted JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Country Status (1)

Country Link
JP (1) JPS51126764A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821849A (ja) * 1981-07-31 1983-02-08 Nec Home Electronics Ltd 樹脂封止型半導体装置
JPS5899842U (ja) * 1981-12-28 1983-07-07 富士通株式会社 半導体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203789A (en) * 1981-06-11 1982-12-14 Inoue Japax Res Inc Partial plating device
JPS63153293A (ja) * 1986-12-17 1988-06-25 Chugoku Denka Kogyo Kk 加工物の表面処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821849A (ja) * 1981-07-31 1983-02-08 Nec Home Electronics Ltd 樹脂封止型半導体装置
JPS5899842U (ja) * 1981-12-28 1983-07-07 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
JPS5314916B2 (enrdf_load_html_response) 1978-05-20

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