JPS5314916B2 - - Google Patents

Info

Publication number
JPS5314916B2
JPS5314916B2 JP5044875A JP5044875A JPS5314916B2 JP S5314916 B2 JPS5314916 B2 JP S5314916B2 JP 5044875 A JP5044875 A JP 5044875A JP 5044875 A JP5044875 A JP 5044875A JP S5314916 B2 JPS5314916 B2 JP S5314916B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5044875A
Other languages
Japanese (ja)
Other versions
JPS51126764A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5044875A priority Critical patent/JPS51126764A/ja
Publication of JPS51126764A publication Critical patent/JPS51126764A/ja
Publication of JPS5314916B2 publication Critical patent/JPS5314916B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP5044875A 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process Granted JPS51126764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044875A JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044875A JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Publications (2)

Publication Number Publication Date
JPS51126764A JPS51126764A (en) 1976-11-05
JPS5314916B2 true JPS5314916B2 (enrdf_load_html_response) 1978-05-20

Family

ID=12859134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044875A Granted JPS51126764A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Country Status (1)

Country Link
JP (1) JPS51126764A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203789A (en) * 1981-06-11 1982-12-14 Inoue Japax Res Inc Partial plating device
JPS63153293A (ja) * 1986-12-17 1988-06-25 Chugoku Denka Kogyo Kk 加工物の表面処理方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821849A (ja) * 1981-07-31 1983-02-08 Nec Home Electronics Ltd 樹脂封止型半導体装置
JPS5899842U (ja) * 1981-12-28 1983-07-07 富士通株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203789A (en) * 1981-06-11 1982-12-14 Inoue Japax Res Inc Partial plating device
JPS63153293A (ja) * 1986-12-17 1988-06-25 Chugoku Denka Kogyo Kk 加工物の表面処理方法

Also Published As

Publication number Publication date
JPS51126764A (en) 1976-11-05

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