JPS51114874A - Semiconductor device formation method - Google Patents

Semiconductor device formation method

Info

Publication number
JPS51114874A
JPS51114874A JP50039100A JP3910075A JPS51114874A JP S51114874 A JPS51114874 A JP S51114874A JP 50039100 A JP50039100 A JP 50039100A JP 3910075 A JP3910075 A JP 3910075A JP S51114874 A JPS51114874 A JP S51114874A
Authority
JP
Japan
Prior art keywords
semiconductor device
formation method
device formation
outer package
metal lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50039100A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5241186B2 (enrdf_load_html_response
Inventor
Kanji Otsuka
Tamotsu Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039100A priority Critical patent/JPS51114874A/ja
Publication of JPS51114874A publication Critical patent/JPS51114874A/ja
Publication of JPS5241186B2 publication Critical patent/JPS5241186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Ceramic Products (AREA)
JP50039100A 1975-04-02 1975-04-02 Semiconductor device formation method Granted JPS51114874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039100A JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039100A JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Publications (2)

Publication Number Publication Date
JPS51114874A true JPS51114874A (en) 1976-10-08
JPS5241186B2 JPS5241186B2 (enrdf_load_html_response) 1977-10-17

Family

ID=12543645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039100A Granted JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Country Status (1)

Country Link
JP (1) JPS51114874A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878443A (ja) * 1981-11-04 1983-05-12 Nec Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878443A (ja) * 1981-11-04 1983-05-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5241186B2 (enrdf_load_html_response) 1977-10-17

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