JPS5039070A - - Google Patents

Info

Publication number
JPS5039070A
JPS5039070A JP49066602A JP6660274A JPS5039070A JP S5039070 A JPS5039070 A JP S5039070A JP 49066602 A JP49066602 A JP 49066602A JP 6660274 A JP6660274 A JP 6660274A JP S5039070 A JPS5039070 A JP S5039070A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49066602A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5039070A publication Critical patent/JPS5039070A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P72/7602—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/14—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines
    • B23Q7/1426—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines with work holders not rigidly fixed to the transport devices
    • B23Q7/1431—Work holder changers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • H10P72/0462—
    • H10P72/0466—
    • H10P72/3302—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
JP49066602A 1973-06-29 1974-06-13 Pending JPS5039070A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US375279A US3874525A (en) 1973-06-29 1973-06-29 Method and apparatus for handling workpieces

Publications (1)

Publication Number Publication Date
JPS5039070A true JPS5039070A (ja) 1975-04-10

Family

ID=23480243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49066602A Pending JPS5039070A (ja) 1973-06-29 1974-06-13

Country Status (5)

Country Link
US (1) US3874525A (ja)
JP (1) JPS5039070A (ja)
DE (1) DE2430462A1 (ja)
FR (1) FR2234969B1 (ja)
GB (1) GB1461677A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50106231A (ja) * 1972-08-26 1975-08-21
JPS5441075A (en) * 1977-09-07 1979-03-31 Nippon Telegr & Teleph Corp <Ntt> Conveying device between atmospheric pressure and vacuum
JPS5457867A (en) * 1977-10-17 1979-05-10 Nichiden Varian Kk Vacuum processor with automatic wafer feeder
JPS564244A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Continuous vacuum treatment device for wafer
JPS60132830A (ja) * 1983-12-20 1985-07-15 Ulvac Corp ウエハ搬送装置
KR20180111592A (ko) * 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 기판 처리 장치

Families Citing this family (86)

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US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
JPS608792B2 (ja) * 1976-11-09 1985-03-05 オリンパス光学工業株式会社 培養容器搬送装置
US4208159A (en) * 1977-07-18 1980-06-17 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of a wafer by plasma reaction
EP0134819A1 (de) * 1978-08-01 1985-03-27 Grisebach, Hans-Theodor Spannzange mit elektromotorischem Spannantrieb
JPS598352Y2 (ja) * 1979-05-28 1984-03-15 富士通株式会社 ガラスマスクの洗浄装置
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US4345866A (en) * 1980-02-22 1982-08-24 Acco Industries Inc. Loader-unloader system for work pieces
US4293249A (en) * 1980-03-03 1981-10-06 Texas Instruments Incorporated Material handling system and method for manufacturing line
US4373840A (en) * 1980-03-28 1983-02-15 Giddings & Lewis, Inc. Pallet transfer system
EP0043059B1 (de) * 1980-06-28 1985-09-25 Alfred Bilsing Transportautomat
US4343584A (en) * 1980-07-11 1982-08-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Apparatus for sequentially transporting containers
US4433951A (en) 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
US4483654A (en) * 1981-02-13 1984-11-20 Lam Research Corporation Workpiece transfer mechanism
US4582191A (en) * 1982-06-17 1986-04-15 Weigand Robert E Article handling apparatus and method
US4909701A (en) * 1983-02-14 1990-03-20 Brooks Automation Inc. Articulated arm transfer device
US4666366A (en) * 1983-02-14 1987-05-19 Canon Kabushiki Kaisha Articulated arm transfer device
WO1984003196A1 (en) * 1983-02-14 1984-08-16 Brooks Ass Articulated arm transfer device
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4558388A (en) * 1983-11-02 1985-12-10 Varian Associates, Inc. Substrate and substrate holder
DE3448599B4 (de) * 1983-11-28 2004-04-08 Hitachi, Ltd. Verfahren zur Durchführung einer Behandlung unter Vakuum
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
US4632624A (en) * 1984-03-09 1986-12-30 Tegal Corporation Vacuum load lock apparatus
DE3415873A1 (de) * 1984-04-28 1985-10-31 Ahrens & Bode GmbH & Co Maschinen- und Apparatebau, 3338 Schöningen Transport- und kodiervorrichtung fuer milchprobenflaschen
US4642438A (en) * 1984-11-19 1987-02-10 International Business Machines Corporation Workpiece mounting and clamping system having submicron positioning repeatability
US5280983A (en) * 1985-01-22 1994-01-25 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US5224809A (en) * 1985-01-22 1993-07-06 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
EP0189279B1 (en) * 1985-01-22 1991-10-09 Applied Materials, Inc. Semiconductor processing system
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
JPS61291032A (ja) * 1985-06-17 1986-12-20 Fujitsu Ltd 真空装置
US4789294A (en) * 1985-08-30 1988-12-06 Canon Kabushiki Kaisha Wafer handling apparatus and method
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
US4909695A (en) * 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US6214119B1 (en) * 1986-04-18 2001-04-10 Applied Materials, Inc. Vacuum substrate processing system having multiple processing chambers and a central load/unload chamber
US5096364A (en) * 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
DE3745134C2 (de) * 1986-05-16 1999-03-04 Silicon Valley Group Verfahren und Einrichtung zur Übertragung eines Wafers von einer Quelle zu einem Zielort
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
DE3716498C2 (de) * 1987-05-16 1994-08-04 Leybold Ag Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
JPH0668962B2 (ja) * 1987-12-21 1994-08-31 株式会社東芝 真空装置及びそれを用いてプロセスを行う方法
EP0343530B1 (de) * 1988-05-24 2001-11-14 Unaxis Balzers Aktiengesellschaft Vakuumanlage
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
JPH0828205B2 (ja) * 1989-10-27 1996-03-21 株式会社日立製作所 ウエハ搬送装置
DE4107077A1 (de) * 1991-01-22 1992-08-13 Stell Karl Wilhelm Dipl Ing Dr Verfahren zum messen von werkstuecken
US5180276A (en) * 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
DE4232959C2 (de) * 1992-10-01 2001-05-10 Leybold Ag Vorrichtung zum Ein- und Ausschleusen scheibenförmiger Substrate
US5431529A (en) * 1992-12-28 1995-07-11 Brooks Automation, Inc. Articulated arm transfer device
KR100303018B1 (ko) * 1993-04-16 2001-11-22 스탠리 디. 피에코스 관절형아암이송장치
DE4427984C2 (de) * 1994-08-08 2003-07-03 Unaxis Deutschland Holding Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
US5543022A (en) * 1995-01-17 1996-08-06 Hmt Technology Corporation Disc-handling apparatus
US5647724A (en) * 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
US6481956B1 (en) 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
US6231297B1 (en) 1995-10-27 2001-05-15 Brooks Automation, Inc. Substrate transport apparatus with angled arms
KR100430885B1 (ko) * 1995-12-15 2004-06-16 브룩스 오토메이션 인코퍼레이티드 관절아암을 구비한 물체이송장치
US5765983A (en) * 1996-05-30 1998-06-16 Brooks Automation, Inc. Robot handling apparatus
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
DE59805566D1 (de) * 1997-04-11 2002-10-24 Leybold Systems Gmbh Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
DE19715151A1 (de) * 1997-04-11 1998-10-15 Leybold Systems Gmbh Verfahren zum Be- und Entladen einer evakuierbaren Behandlungskammer und Handlingsvorrichtung zur Durchführung des Verfahrens
DE19742923A1 (de) 1997-09-29 1999-04-01 Leybold Systems Gmbh Vorrichtung zum Beschichten eines im wesentlichen flachen, scheibenförmigen Substrats
JP3286240B2 (ja) * 1998-02-09 2002-05-27 日本エー・エス・エム株式会社 半導体処理用ロードロック装置及び方法
US6413459B1 (en) 1998-08-05 2002-07-02 Micron Technology, Inc. Method for handling and processing microelectronic-device substrate assemblies
US6250870B1 (en) 1998-08-05 2001-06-26 Micron Electronics, Inc. Apparatus for handling and processing microelectronic-device substrate assemblies
CA2367204A1 (en) * 1999-03-19 2000-09-28 Electron Vision Corporation Cluster tool for wafer processing having an electron beam exposure module
US6429139B1 (en) * 1999-12-17 2002-08-06 Eaton Corporation Serial wafer handling mechanism
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
DE10146838A1 (de) * 2001-09-24 2003-04-10 Ptr Praez Stechnik Gmbh Werkstückzufuhrvorrichtung für eine Elektronenstrahlbearbeitungsvorrichtung
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050113964A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Sensor methods and systems for semiconductor handling
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
DE102006046968A1 (de) * 2006-10-04 2008-04-10 Singulus Technologies Ag Oberflächenbehandlungssystem und darin verwendbare Lackiervorrichtung
US8007223B2 (en) * 2006-10-10 2011-08-30 Von Ardenne Anlagentechnik Gmbh Transport device, loading device and method for loading and unloading the transport device
CN101956173B (zh) * 2009-07-20 2013-06-05 鸿富锦精密工业（深圳）有限公司 使用承载组件的镀膜装置
US9920418B1 (en) * 2010-09-27 2018-03-20 James Stabile Physical vapor deposition apparatus having a tapered chamber
WO2012122489A2 (en) * 2011-03-09 2012-09-13 Rolls-Royce Corporation Automated object manipulation system
US8851816B2 (en) 2011-04-07 2014-10-07 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
JP6298569B1 (ja) * 2017-10-20 2018-03-20 株式会社松浦機械製作所 パレット交換装置
JP7421390B2 (ja) * 2020-03-25 2024-01-24 本田技研工業株式会社 ワーク供給払出装置
TWI762230B (zh) * 2021-03-08 2022-04-21 天虹科技股份有限公司 遮擋機構及具有遮擋機構的基板處理腔室

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US2094753A (en) * 1933-02-08 1937-10-05 Ryan Coffee Corp Apparatus for sealing containers under vacuum or gas
US2938804A (en) * 1957-09-13 1960-05-31 Armour & Co Irradiation method and apparatus
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US3339273A (en) * 1963-02-11 1967-09-05 Fosdick Machine Tool Co Automatic tool changing apparatus for machine tools
IT713325A (ja) * 1964-01-10
US3286344A (en) * 1965-03-01 1966-11-22 Kearney & Trecker Corp Machine tool with a tool changer
US3355798A (en) * 1966-07-27 1967-12-05 Kearney & Trecker Corp Machine tool with a tool changer
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US3541921A (en) * 1968-10-01 1970-11-24 Gleason Works Apparatus for transferring work blanks and workpieces in bevel gear making machines

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50106231A (ja) * 1972-08-26 1975-08-21
JPS5441075A (en) * 1977-09-07 1979-03-31 Nippon Telegr & Teleph Corp <Ntt> Conveying device between atmospheric pressure and vacuum
JPS5457867A (en) * 1977-10-17 1979-05-10 Nichiden Varian Kk Vacuum processor with automatic wafer feeder
JPS564244A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Continuous vacuum treatment device for wafer
JPS60132830A (ja) * 1983-12-20 1985-07-15 Ulvac Corp ウエハ搬送装置
KR20180111592A (ko) * 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US10679878B2 (en) 2017-03-31 2020-06-09 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
FR2234969A1 (ja) 1975-01-24
GB1461677A (en) 1977-01-19
US3874525A (en) 1975-04-01
FR2234969B1 (ja) 1976-10-15
DE2430462A1 (de) 1975-01-16

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