JPH11509050A - 2つまたは2つよりも多い導体パターンの間に導電結合を形成する方法 - Google Patents
2つまたは2つよりも多い導体パターンの間に導電結合を形成する方法Info
- Publication number
- JPH11509050A JPH11509050A JP9539424A JP53942497A JPH11509050A JP H11509050 A JPH11509050 A JP H11509050A JP 9539424 A JP9539424 A JP 9539424A JP 53942497 A JP53942497 A JP 53942497A JP H11509050 A JPH11509050 A JP H11509050A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- conductive
- support
- forming
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.2つまたは2つよりも多い導体パターン(2,2′,4,4′)であって 、しかもこれらの導体パターンうちの少なくとも1つが支持体(3,3′)と結 合されて1つの導体複合系を形成していて、さらに該導体複合系のうちの少なく とも1つが、導体パターンのコンタクト個所の範囲に複数の貫通孔(6,6′) を有しているような2つまたは2つよりも多い導体パターンの間に少なくとも1 つの導電結合を形成する方法において、前記支持体(3,3′)のうちの少なく とも1つを熱可塑性のプラスチックから形成し、導電結合を形成するために熱エ ネルギを前記貫通孔(6,6′)の範囲に局所的に供給することを特徴とする、 2つまたは2つよりも多い導体パターンの間に導電結合を形成する方法。 2.前記貫通孔(6,6′)に、導電性の質量体(9)を導入する、請求項1 記載の方法。 3.導電性の質量体(9)が導電ペースト、導電接着剤、ろう接ペーストまた はろう接シートである、請求項2記載の方法。 4.熱エネルギを、熱放射線、溶接法、特にスポット溶接、ギャップ溶接、ク ローズ溶接、ろう接法、超音波法、熱圧着法、超音波併用熱圧着法またはレーザ 法(10,10′,10′′)により供給する、請求 項1から3までのいずれか1項記載の方法。 5.導体パターン(2,2′)が各1つの支持体(3,3′)に配置されてい るか、または各1つの支持体に組み込まれている、請求項1から4までのいずれ か1項記載の方法。 6.全ての支持体(3,3′)が熱可塑性のプラスチックから成っている、請 求項5記載の方法。 7.複数の導体複合系(2,3;2′,3′)のうちの厚い方の導体複合系に 設けられた前記貫通孔の範囲に、導電結合を形成する、請求項6記載の方法。 8.当該方法を、シートに組み込まれた金属の接続フレーム(4)と、熱可塑 性の支持体(3,3′)に配置された少なくとも1つの導体パターン(2,2′ )との間に導電結合を形成するために使用する、請求項1から7までのいずれか 1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19618099A DE19618099A1 (de) | 1996-05-06 | 1996-05-06 | Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen |
DE19618099.6 | 1996-05-06 | ||
PCT/DE1997/000871 WO1997042798A1 (de) | 1996-05-06 | 1997-04-29 | Verfahren zur herstellung elektrisch leitender verbindungen zwischen zwei oder mehr leiterstrukturen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11509050A true JPH11509050A (ja) | 1999-08-03 |
JP3270057B2 JP3270057B2 (ja) | 2002-04-02 |
Family
ID=7793448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53942497A Expired - Lifetime JP3270057B2 (ja) | 1996-05-06 | 1997-04-29 | 2つまたは2つよりも多い導体パターンの間に導電結合を形成する方法 |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP0897654B1 (ja) |
JP (1) | JP3270057B2 (ja) |
KR (1) | KR20000010669A (ja) |
CN (1) | CN1105485C (ja) |
AT (1) | ATE188082T1 (ja) |
BR (1) | BR9708919A (ja) |
DE (2) | DE19618099A1 (ja) |
ES (1) | ES2141617T3 (ja) |
IN (1) | IN192456B (ja) |
RU (1) | RU2168877C2 (ja) |
UA (1) | UA44845C2 (ja) |
WO (1) | WO1997042798A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190086358A (ko) * | 2018-01-12 | 2019-07-22 | 신꼬오덴기 고교 가부시키가이샤 | 지지체 부착 기판 및 지지체 부착 기판의 제조 방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50003179D1 (de) | 1999-02-18 | 2003-09-11 | Siemens Ag | Elektrisches verbindungsverfahren und verbindungsstelle |
FR2797976B1 (fr) * | 1999-08-25 | 2002-03-22 | Gemplus Card Int | Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede |
DE10105163A1 (de) * | 2000-11-06 | 2002-05-16 | Cubit Electronics Gmbh | Verfahren und Anordnung zum Kontaktieren von auf Sunbstratfolien angeordneten metallischen Kontaktflächen |
DE10104414A1 (de) * | 2001-02-01 | 2002-08-29 | Hella Kg Hueck & Co | Elektrotechnisches Bauteil, Verfahren zum Verlöten dieses Bauteils mit einem weiteren elektrotechnischen Bauteil sowie Anordnung dieser miteinander verlöteten Bauteile |
DE10134621A1 (de) * | 2001-07-17 | 2003-02-06 | Bosch Gmbh Robert | Verbindung mehrerer elektrischer Bauteile |
DE102007062202B4 (de) | 2007-12-21 | 2021-06-10 | Vitesco Technologies GmbH | Beschreibung Verfahren zur Kontaktierung einer starren Leiterplatte mit einem Kontaktpartner und Anordnung aus starrer Leiterplatte und Kontaktpartner |
DE102008017152B4 (de) * | 2008-04-03 | 2023-02-23 | Vitesco Technologies GmbH | Verfahren zum Herstellen einer elektrischen und/oder mechanischen Verbindung zwischen einer Leiterplatte und einem Kontaktpartner sowie Verbundsystem |
FR2981536B1 (fr) * | 2011-10-12 | 2014-05-16 | Bilal Manai | Assemblage d'un ensemble-batterie |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1951778B2 (de) * | 1969-10-14 | 1971-08-15 | Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien | |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
US5311407A (en) * | 1992-04-30 | 1994-05-10 | Siemens Components, Inc. | Printed circuit based for mounted semiconductors and other electronic components |
DE4319876A1 (de) * | 1993-02-26 | 1994-09-01 | Siemens Ag | Verfahren zum Befestigen einer Hybrid-Schaltung auf einer Leiterplatte |
DE4327560A1 (de) * | 1993-08-17 | 1995-02-23 | Hottinger Messtechnik Baldwin | Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung |
DE4337920A1 (de) * | 1993-11-06 | 1995-05-11 | Manfred Dr Michalk | Verfahren und Anordnung zur Erzeugung eines permanenten elektrischen Druckkontaktes |
-
1996
- 1996-05-06 DE DE19618099A patent/DE19618099A1/de not_active Withdrawn
-
1997
- 1997-04-29 EP EP97922889A patent/EP0897654B1/de not_active Expired - Lifetime
- 1997-04-29 UA UA98115900A patent/UA44845C2/uk unknown
- 1997-04-29 WO PCT/DE1997/000871 patent/WO1997042798A1/de not_active Application Discontinuation
- 1997-04-29 CN CN97194388A patent/CN1105485C/zh not_active Expired - Lifetime
- 1997-04-29 AT AT97922889T patent/ATE188082T1/de active
- 1997-04-29 KR KR1019980708647A patent/KR20000010669A/ko not_active Application Discontinuation
- 1997-04-29 RU RU98122063/09A patent/RU2168877C2/ru active
- 1997-04-29 ES ES97922889T patent/ES2141617T3/es not_active Expired - Lifetime
- 1997-04-29 DE DE59700902T patent/DE59700902D1/de not_active Expired - Lifetime
- 1997-04-29 JP JP53942497A patent/JP3270057B2/ja not_active Expired - Lifetime
- 1997-04-29 BR BR9708919A patent/BR9708919A/pt not_active IP Right Cessation
- 1997-05-05 IN IN802CA1997 patent/IN192456B/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190086358A (ko) * | 2018-01-12 | 2019-07-22 | 신꼬오덴기 고교 가부시키가이샤 | 지지체 부착 기판 및 지지체 부착 기판의 제조 방법 |
JP2019125615A (ja) * | 2018-01-12 | 2019-07-25 | 新光電気工業株式会社 | 支持体付基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3270057B2 (ja) | 2002-04-02 |
DE59700902D1 (de) | 2000-01-27 |
IN192456B (ja) | 2004-04-24 |
DE19618099A1 (de) | 1997-11-13 |
WO1997042798A1 (de) | 1997-11-13 |
RU2168877C2 (ru) | 2001-06-10 |
CN1217868A (zh) | 1999-05-26 |
UA44845C2 (uk) | 2002-03-15 |
CN1105485C (zh) | 2003-04-09 |
EP0897654B1 (de) | 1999-12-22 |
ATE188082T1 (de) | 2000-01-15 |
BR9708919A (pt) | 1999-08-03 |
EP0897654A1 (de) | 1999-02-24 |
KR20000010669A (ko) | 2000-02-25 |
ES2141617T3 (es) | 2000-03-16 |
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