IN192456B - - Google Patents
Info
- Publication number
- IN192456B IN192456B IN802CA1997A IN192456B IN 192456 B IN192456 B IN 192456B IN 802CA1997 A IN802CA1997 A IN 802CA1997A IN 192456 B IN192456 B IN 192456B
- Authority
- IN
- India
- Prior art keywords
- conductor
- electrically conducting
- connection
- structures
- conductor structures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Multi-Conductor Connections (AREA)
Abstract
This invention concerns a process for establishing at least one electrically conducting connection between two or more conductor structures (2, 4), of which at least one is connected to a carrier (3) to form a conductor compound system. At least one of the conductor compound systems has openings (6) at the points of contact of the conductor structure in the region of which the connection is established by supplying thermal energy or by introducing an electrically conducting material. The invention makes it possible to establish electrically conducting connections between several conductor structures in a simple and cost-efficient manner and avoids damage even to temperature-sensitive thermoplastic carriers.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19618099A DE19618099A1 (en) | 1996-05-06 | 1996-05-06 | Compound conductor system and method for producing electrically conductive connections between two or more conductor structures |
Publications (1)
Publication Number | Publication Date |
---|---|
IN192456B true IN192456B (en) | 2004-04-24 |
Family
ID=7793448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN802CA1997 IN192456B (en) | 1996-05-06 | 1997-05-05 |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP0897654B1 (en) |
JP (1) | JP3270057B2 (en) |
KR (1) | KR20000010669A (en) |
CN (1) | CN1105485C (en) |
AT (1) | ATE188082T1 (en) |
BR (1) | BR9708919A (en) |
DE (2) | DE19618099A1 (en) |
ES (1) | ES2141617T3 (en) |
IN (1) | IN192456B (en) |
RU (1) | RU2168877C2 (en) |
UA (1) | UA44845C2 (en) |
WO (1) | WO1997042798A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50003179D1 (en) * | 1999-02-18 | 2003-09-11 | Siemens Ag | ELECTRICAL CONNECTION METHOD AND CONNECTING POINT |
FR2797976B1 (en) * | 1999-08-25 | 2002-03-22 | Gemplus Card Int | METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD |
DE10105163A1 (en) * | 2000-11-06 | 2002-05-16 | Cubit Electronics Gmbh | Process for contacting metallic contact fields arranged on substrate foils comprises preparing contact fields with a lattice structure, positioning the regions to be contacted and pressing together with a light-permeable pressing piece |
DE10104414A1 (en) * | 2001-02-01 | 2002-08-29 | Hella Kg Hueck & Co | Electrotechnical component has bores near contact surface; bores can be distributed uniformly over entire contact surface, arranged in raster with bore diameter of from 0.5 to 2 mm. |
DE10134621A1 (en) * | 2001-07-17 | 2003-02-06 | Bosch Gmbh Robert | Connection for several electrical components in vehicle has third component connected to conducting track connection via flexible foil and hence to first and/or second electrical components |
DE102007062202B4 (en) * | 2007-12-21 | 2021-06-10 | Vitesco Technologies GmbH | Description Process for contacting a rigid circuit board with a contact partner and an arrangement of rigid circuit board and contact partner |
DE102008017152B4 (en) * | 2008-04-03 | 2023-02-23 | Vitesco Technologies GmbH | Method for producing an electrical and/or mechanical connection between a printed circuit board and a contact partner, and composite system |
FR2981536B1 (en) * | 2011-10-12 | 2014-05-16 | Bilal Manai | ASSEMBLY OF A BATTERY ASSEMBLY |
JP7065617B2 (en) * | 2018-01-12 | 2022-05-12 | 新光電気工業株式会社 | Substrate with support and its manufacturing method |
DE102022214047A1 (en) | 2022-12-20 | 2024-06-20 | Continental Automotive Technologies GmbH | Method for manufacturing a current sensor, measuring resistor assembly and circuit board for current sensor and current sensor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1951778B2 (en) * | 1969-10-14 | 1971-08-15 | Multilayer flexible printed circuit | |
JPH03283594A (en) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | Circuit board |
US5311407A (en) * | 1992-04-30 | 1994-05-10 | Siemens Components, Inc. | Printed circuit based for mounted semiconductors and other electronic components |
DE4319876A1 (en) * | 1993-02-26 | 1994-09-01 | Siemens Ag | Method of mounting a hybrid circuit on a printed circuit board |
DE4327560A1 (en) * | 1993-08-17 | 1995-02-23 | Hottinger Messtechnik Baldwin | Method for connecting interconnection arrangements and contact arrangement |
DE4337920A1 (en) * | 1993-11-06 | 1995-05-11 | Manfred Dr Michalk | Method and arrangement for producing a permanent electrical pressure contact |
-
1996
- 1996-05-06 DE DE19618099A patent/DE19618099A1/en not_active Withdrawn
-
1997
- 1997-04-29 BR BR9708919A patent/BR9708919A/en not_active IP Right Cessation
- 1997-04-29 EP EP97922889A patent/EP0897654B1/en not_active Expired - Lifetime
- 1997-04-29 RU RU98122063/09A patent/RU2168877C2/en active
- 1997-04-29 CN CN97194388A patent/CN1105485C/en not_active Expired - Lifetime
- 1997-04-29 AT AT97922889T patent/ATE188082T1/en active
- 1997-04-29 DE DE59700902T patent/DE59700902D1/en not_active Expired - Lifetime
- 1997-04-29 JP JP53942497A patent/JP3270057B2/en not_active Expired - Lifetime
- 1997-04-29 UA UA98115900A patent/UA44845C2/en unknown
- 1997-04-29 ES ES97922889T patent/ES2141617T3/en not_active Expired - Lifetime
- 1997-04-29 WO PCT/DE1997/000871 patent/WO1997042798A1/en not_active Application Discontinuation
- 1997-04-29 KR KR1019980708647A patent/KR20000010669A/en not_active Application Discontinuation
- 1997-05-05 IN IN802CA1997 patent/IN192456B/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE19618099A1 (en) | 1997-11-13 |
BR9708919A (en) | 1999-08-03 |
UA44845C2 (en) | 2002-03-15 |
JPH11509050A (en) | 1999-08-03 |
EP0897654B1 (en) | 1999-12-22 |
CN1105485C (en) | 2003-04-09 |
ATE188082T1 (en) | 2000-01-15 |
CN1217868A (en) | 1999-05-26 |
DE59700902D1 (en) | 2000-01-27 |
RU2168877C2 (en) | 2001-06-10 |
EP0897654A1 (en) | 1999-02-24 |
JP3270057B2 (en) | 2002-04-02 |
ES2141617T3 (en) | 2000-03-16 |
WO1997042798A1 (en) | 1997-11-13 |
KR20000010669A (en) | 2000-02-25 |
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