DE1951778B2 - Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien - Google Patents
Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolienInfo
- Publication number
- DE1951778B2 DE1951778B2 DE19691951778 DE1951778A DE1951778B2 DE 1951778 B2 DE1951778 B2 DE 1951778B2 DE 19691951778 DE19691951778 DE 19691951778 DE 1951778 A DE1951778 A DE 1951778A DE 1951778 B2 DE1951778 B2 DE 1951778B2
- Authority
- DE
- Germany
- Prior art keywords
- holes
- printed circuit
- flexible printed
- multilayer flexible
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691951778 DE1951778B2 (de) | 1969-10-14 | 1969-10-14 | Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691951778 DE1951778B2 (de) | 1969-10-14 | 1969-10-14 | Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1951778A1 DE1951778A1 (de) | 1971-05-06 |
DE1951778B2 true DE1951778B2 (de) | 1971-08-15 |
Family
ID=5748168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19691951778 Withdrawn DE1951778B2 (de) | 1969-10-14 | 1969-10-14 | Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1951778B2 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2527213A1 (de) * | 1974-06-17 | 1976-01-02 | Cavis Cavetti Isolati Spa | Verbesserter bandfoermiger leiter |
DE2843710A1 (de) * | 1977-10-06 | 1979-04-19 | Asahi Optical Co Ltd | Mehrlagige flexible schaltungsplattenanordnung und verfahren zu ihrer herstellung |
DE3534653A1 (de) * | 1984-09-28 | 1986-04-03 | Yazaki Corp., Tokio/Tokyo | Kabelbaum fuer automobile |
DE19618099A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5146674A (en) * | 1991-07-01 | 1992-09-15 | International Business Machines Corporation | Manufacturing process of a high density substrate design |
US6092282A (en) * | 1992-02-14 | 2000-07-25 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
US6112406A (en) * | 1996-05-06 | 2000-09-05 | Siemens Aktiengesellschaft | Method for producing electrically conductive connections between two or more conductor structures |
GB2331148A (en) * | 1997-11-08 | 1999-05-12 | Kigass Engineering Limited | Rotary actuator |
DE102006021096B4 (de) * | 2006-05-05 | 2018-10-25 | Continental Automotive Gmbh | Leiterbahnträger |
-
1969
- 1969-10-14 DE DE19691951778 patent/DE1951778B2/de not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2527213A1 (de) * | 1974-06-17 | 1976-01-02 | Cavis Cavetti Isolati Spa | Verbesserter bandfoermiger leiter |
DE2843710A1 (de) * | 1977-10-06 | 1979-04-19 | Asahi Optical Co Ltd | Mehrlagige flexible schaltungsplattenanordnung und verfahren zu ihrer herstellung |
DE3534653A1 (de) * | 1984-09-28 | 1986-04-03 | Yazaki Corp., Tokio/Tokyo | Kabelbaum fuer automobile |
DE19618099A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen |
Also Published As
Publication number | Publication date |
---|---|
DE1951778A1 (de) | 1971-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
E77 | Valid patent as to the heymanns-index 1977 | ||
EHJ | Ceased/non-payment of the annual fee |