JPS6478412A - Formation of through hole in thin film multilayer body - Google Patents

Abstract

PURPOSE:To generate through holes with a high aspect ratio by generating a single groove part connecting both conductive parts in the part of an insulating layer where the through holes are generated, filling materials which are easy for the generation of the through holes in the groove part and generating the through hole. CONSTITUTION:The insulating layer 32 laminated on a lower insulating layer 31 where plural lower wirings 30 are generated. Next, the single groove part 33 is generated in a part where the through holes are generated corresponding to the lower wirings 30 in the insulating layer 32, and materials 34 which are easy for the generation of the through holes and which are superior in etching are filled in the groove part 33. The through holes 35 communicating with the lower wirings 30 are generated in the materials 34, and conductors 36 are filled in the through holes 35. An upper insulating layer 37 and upper wirings 38 are generated on the insulating layer 32 in which the conductors 36 are filled, and the upper wirings 38 and the lower wirings 30 are electrically connected by the conductors 36. Since the materials which are superior in the etching can be selected, the through holes 35 of the large aspect ratio can easily be generated and the wiring of high density can be executed.