JPH11508326A - 基板上への焼結体の製造方法 - Google Patents
基板上への焼結体の製造方法Info
- Publication number
- JPH11508326A JPH11508326A JP9536896A JP53689697A JPH11508326A JP H11508326 A JPH11508326 A JP H11508326A JP 9536896 A JP9536896 A JP 9536896A JP 53689697 A JP53689697 A JP 53689697A JP H11508326 A JPH11508326 A JP H11508326A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- substrate
- layer
- sintered
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/22—Direct deposition of molten metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/02—Moulding by agglomerating
- B29C67/04—Sintering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
- C03C17/256—Coating containing TiO2
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0036—Laser treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/212—TiO2
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/113—Deposition methods from solutions or suspensions by sol-gel processes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.粒子を含有した液体を、インクジェットプリンタを用いて基板上に堆積し、 その後、前記液体を蒸発させ、液体中に存在する粒子を焼結して、基板上に焼結 体を製造するに当たり、前記粒子をレーザを用いて焼結することを特徴とする基 板上への焼結体の製造方法。 2.前記液体の蒸発をレーザを用いて行うことを特徴とする請求項1に記載の基 板上への焼結体の製造方法。 3.前記液体の蒸発と前記粒子の焼結とを、同じレーザを用いて行うことを特徴 とする請求項2に記載の基板上への焼結体の製造方法。 4.前記液体は、ガラス、セラミックス、及び金属化合物を含み、ゾル・ゲル又 はコロイド状を呈することを特徴とする請求項1〜3のいずれかに記載の基板上 への焼結体の製造方法。 5.マルチプリントヘッドを有するインクジェットプリンタを使用することを特 徴とする請求項1〜4のいずれかに記載の基板上への焼結体の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96201003.9 | 1996-04-17 | ||
EP96201003 | 1996-04-17 | ||
PCT/IB1997/000281 WO1997038810A1 (en) | 1996-04-17 | 1997-03-21 | Method of manufacturing a sintered structure on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11508326A true JPH11508326A (ja) | 1999-07-21 |
JP4346684B2 JP4346684B2 (ja) | 2009-10-21 |
Family
ID=8223874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53689697A Expired - Lifetime JP4346684B2 (ja) | 1996-04-17 | 1997-03-21 | 基板上への焼結体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6531191B1 (ja) |
EP (1) | EP0847314B1 (ja) |
JP (1) | JP4346684B2 (ja) |
DE (1) | DE69700945T2 (ja) |
WO (1) | WO1997038810A1 (ja) |
Cited By (13)
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---|---|---|---|---|
JP2006269984A (ja) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
US7311937B2 (en) | 2001-10-31 | 2007-12-25 | Seiko Epson Corporation | Method for forming a line pattern, line pattern, and electro-optic device |
JP2010239149A (ja) * | 2010-06-21 | 2010-10-21 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
US8463116B2 (en) | 2008-07-01 | 2013-06-11 | Tap Development Limited Liability Company | Systems for curing deposited material using feedback control |
JP2013135165A (ja) * | 2011-12-27 | 2013-07-08 | Ricoh Co Ltd | 薄膜製造装置、薄膜製造方法、液滴吐出ヘッド、及びインクジェット記録装置 |
JP2014518589A (ja) * | 2011-04-12 | 2014-07-31 | ダイパワー | 金属酸化物系配合物の焼結法 |
JP2015081380A (ja) * | 2013-10-24 | 2015-04-27 | 株式会社リコー | 三次元構造物の造形方法、装置、及び三次元構造物の造形装置に用いる造形材収納容器 |
JP2015136831A (ja) * | 2014-01-21 | 2015-07-30 | トヨタ自動車株式会社 | ステータの製造方法 |
WO2016208671A1 (ja) * | 2015-06-23 | 2016-12-29 | 旭硝子株式会社 | 焼成成形体およびその製造方法、焼成成形体を備える物品、焼成成形体用材料、ならびに、焼成前成形体およびその製造方法 |
JP2018090471A (ja) * | 2016-11-10 | 2018-06-14 | グッドリッチ コーポレイション | 低膨張ガラスの粉体層付加製造 |
JP2018199864A (ja) * | 2017-05-25 | 2018-12-20 | 東邦塗料工業股▲分▼有限公司Donbon Paints Industrial Co.,Ltd | レーザ焼結造形用金属コロイドの作製方法 |
JP2020100885A (ja) * | 2018-12-25 | 2020-07-02 | エルジー・ケム・リミテッド | 成形装置及び成形体の製造方法 |
US11154933B2 (en) | 2015-12-17 | 2021-10-26 | Seiko Epson Corporation | Three-dimensional shaped article production method, three-dimensional shaped article production apparatus, and three-dimensional shaped article |
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US20090075083A1 (en) | 1997-07-21 | 2009-03-19 | Nanogram Corporation | Nanoparticle production and corresponding structures |
US7226966B2 (en) | 2001-08-03 | 2007-06-05 | Nanogram Corporation | Structures incorporating polymer-inorganic particle blends |
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US6348295B1 (en) | 1999-03-26 | 2002-02-19 | Massachusetts Institute Of Technology | Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
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US6957608B1 (en) | 2002-08-02 | 2005-10-25 | Kovio, Inc. | Contact print methods |
JP4244382B2 (ja) * | 2003-02-26 | 2009-03-25 | セイコーエプソン株式会社 | 機能性材料定着方法及びデバイス製造方法 |
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US5284695A (en) * | 1989-09-05 | 1994-02-08 | Board Of Regents, The University Of Texas System | Method of producing high-temperature parts by way of low-temperature sintering |
US5204055A (en) * | 1989-12-08 | 1993-04-20 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
BE1004844A7 (fr) * | 1991-04-12 | 1993-02-09 | Laude Lucien Diego | Methodes de metallisation de surfaces a l'aide de poudres metalliques. |
US5188902A (en) * | 1991-05-30 | 1993-02-23 | Northern Illinois University | Production of PT/PZT/PLZI thin films, powders, and laser `direct write` patterns |
US5314003A (en) * | 1991-12-24 | 1994-05-24 | Microelectronics And Computer Technology Corporation | Three-dimensional metal fabrication using a laser |
FR2688803B1 (fr) * | 1992-03-23 | 1994-05-06 | European Gas Turbines Sa | Procede de revetement d'une encoche d'une piece en alliage de nickel par laser. |
US5688564A (en) * | 1992-07-23 | 1997-11-18 | Institut Polytechnique De Sevenans | Process for the preparation and coating of a surface |
JP4346684B2 (ja) * | 1996-04-17 | 2009-10-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 基板上への焼結体の製造方法 |
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1997
- 1997-03-21 JP JP53689697A patent/JP4346684B2/ja not_active Expired - Lifetime
- 1997-03-21 DE DE69700945T patent/DE69700945T2/de not_active Expired - Lifetime
- 1997-03-21 EP EP97906829A patent/EP0847314B1/en not_active Expired - Lifetime
- 1997-03-21 WO PCT/IB1997/000281 patent/WO1997038810A1/en active IP Right Grant
- 1997-04-16 US US08/834,410 patent/US6531191B1/en not_active Expired - Lifetime
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JP4609846B2 (ja) * | 2005-03-25 | 2011-01-12 | 古河電気工業株式会社 | 金属焼成体の製造方法及びそれに用いられる金属粒子焼成用材料並びにそれにより得られる配線パターン |
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JP2010239149A (ja) * | 2010-06-21 | 2010-10-21 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
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JP2018199864A (ja) * | 2017-05-25 | 2018-12-20 | 東邦塗料工業股▲分▼有限公司Donbon Paints Industrial Co.,Ltd | レーザ焼結造形用金属コロイドの作製方法 |
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Also Published As
Publication number | Publication date |
---|---|
DE69700945T2 (de) | 2000-07-20 |
JP4346684B2 (ja) | 2009-10-21 |
EP0847314B1 (en) | 1999-12-15 |
US6531191B1 (en) | 2003-03-11 |
EP0847314A1 (en) | 1998-06-17 |
WO1997038810A1 (en) | 1997-10-23 |
DE69700945D1 (de) | 2000-01-20 |
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